| Press Releases 223 to 228 of 1806 |
 |
| 11.06.2024 09:00 |
Infineon introduces Power System Reliability Modeling to reduce power shortages and blackouts in data center systems |
|
Munich, Germany – 11 June 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces Power System Reliability Modeling, an innovative solution addressing the increasing challenges faced by data centers and telecom infrastructures due to power supply failures in the system. With 39 percent of downtimes attributed to power outages and an average cost of $687,700 per downtime, the need for seamless operations and mitigation of financial impact is urgent. By integrating Infineon’s power monitoring solution, organizations can enhance operational resilience, reduce their carbon-footprint and achieve substantial cost savings. The offering consists of an algorithm running on a digital power controller, thus integrating software and hardware. This is in line with Infineon’s strategic approach to provide customers with comprehensive system solutions that include both semiconductor devices and matching software tools. Target applications of the solution include DCDC converters, ACDC rectifiers and IBC modules utilized in data centers, AI servers, GPUs, and telecom networks. |
|
|
| 10.06.2024 10:00 |
Infineon leads the way in decarbonization with Product Carbon Footprint data for customers |
|
Munich, Germany – 10 June 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will provide customers with comprehensive Product Carbon Footprint (PCF) data, taking a pioneering role in the semiconductor industry. The company is committed to eventually providing PCF data for its entire product portfolio, starting now with about half of its portfolio. The initiative will empower customers to advance their own sustainability goals and reduce their carbon footprint effectively along the entire supply chain. The Product Carbon Footprint is a metric that quantifies the greenhouse gas emissions associated with an individual product, allowing the comparison of different products’ climate impact. Infineon will share more insights with customers at the upcoming PCIM trade fair in Nuremberg, Germany, from 11 to 13 June 2024. |
|
|
| 07.06.2024 10:15 |
Infineon introduces new 600 V CoolMOS™ S7TA MOSFETs featuring integrated high-precision temperature sensor |
|
Munich, Germany – 7 June 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced the 600 V CoolMOS™ S7TA Superjunction MOSFET for automotive power management applications. Designed to meet the specific requirements of automotive electronics, the S7TA features an integrated temperature sensor that significantly improves the accuracy of junction temperature sensing, building on the advances made by its counterpart for industrial applications (CoolMOS S7T). The resulting benefits include improved durability, safety, and efficiency, all of which are essential in the automotive domain. |
|
|
| 06.06.2024 10:15 |
Infineon presents new 600 V CoolMOS™ 8 SJ MOSFET family for advanced and cost-effective power supply applications |
|
Munich, Germany – 6 June 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the 600 V CoolMOS™ 8 high voltage superjunction (SJ) MOSFET product family. The devices combine the best features of the 600 V CoolMOS 7 MOSFET series and are the successors to the P7, PFD7, C7, CFD7, G7 and S7 product families. The new superjunction MOSFETs enable cost-effective Si-based solutions that enhance Infineon's wide-bandgap offering. They are equipped with an integrated fast body diode, making them suitable for a wide range of applications such as server and industrial switched-mode power supply units (SMPS), EV chargers, and micro-solar. |
|
|
| 05.06.2024 10:15 |
Infineon announces CoolGaN™ bidirectional switch and CoolGaN Smart Sense for higher performance and more cost-effective power systems |
|
Munich, Germany – 5 June, 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced two new CoolGaN™ product technologies, CoolGaN bidirectional switch (BDS) and CoolGaN Smart Sense. CoolGaN BDS provides exceptional soft- and hard-switching behavior, with bidirectional switches available at 40 V, 650 V and 850 V. Target Applications of this family include mobile device USB ports, battery management systems, inverters, and rectifiers. The CoolGaN Smart Sense products feature lossless current sensing, simplifying design and further reducing power losses, as well as transistor switch functions integrated into one package. They are ideal for usage in consumer USB-C chargers and adapters. |
|
|
| 03.06.2024 10:15 |
New industrial CoolSiC™ MOSFETs 650 V G2 in TOLT and Thin-TOLL package increase system power density |
|
Munich, Germany – 3 June 2024 – The electronics industry is witnessing a significant shift towards more compact and powerful systems, driven by technological advancements and a growing focus on decarbonization efforts. With the introduction of the Thin-TOLL 8x8 and TOLT packages, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is actively accelerating and supporting these trends. They enable a maximum utilization of the PCB mainboard and daughter cards, while also taking the system’s thermal requirements and space restrictions into account. The company is now expanding its portfolio of CoolSiC™ MOSFET discretes 650 V with two new product families housed in the Thin-TOLL 8x8 and TOLT packages. They are based on the CoolSiC Generation 2 (G2) technology, offering significantly improved figures-of-merit, reliability, and ease-of-use. Both product families specifically target high and medium switching-mode power supplies (SMPS), including AI servers, renewable energy, EV chargers, and large home appliances. |
|
|
| |
««
«
36
37
38
39
40
»
»»
|
|
|
|
|
|
