| Press Releases 223 to 228 of 1743 |
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| 25.01.2024 14:15 |
Infineon joins hands with Sinexcel to expand the energy storage market and promote the development of green energy |
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Munich, Germany, and Shenzhen, China – 25 January 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced a partnership with Shenzhen based Sinexcel Electric Co., Ltd., a global leader in core power equipment and solutions for the Energy Internet. Infineon will provide Sinexcel with its industry-leading 1200 V CoolSiC™ MOSFET power semiconductor devices in combination with EiceDRIVER™ compact 1200 V single-channel isolated gate drive ICs to further improve the efficiency of energy storage systems. |
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| 25.01.2024 11:45 |
Infineon’s latest acquisition GaN Systems receives “Graduate Of The Year” Award by the Cleantech Group |
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Munich, Germany and San Francisco, USA – 25 January 2024 – Acquired by Infineon Technologies (FSE: IFX / OTCQX: IFNNY) in October 2023, GaN Systems has been recognized as the “Graduate Of The Year” by The Global Cleantech 100. The announcement was made at Cleantech Forum North America in San Francisco. |
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| 25.01.2024 08:15 |
Infineon and Anker open joint Innovation Application Center for PD fast charging and CO2-saving solutions |
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Munich, Germany, and Shenzhen, China – 25 January 2024 – Today, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced its joint Innovation Application Center in Shenzhen with Anker Innovations, a global leader in charging technology. With the center already fully operating, it is paving the way for more energy-efficient and CO2-saving charging solutions that support decarbonization. |
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| 23.01.2024 11:00 |
Infineon and Wolfspeed expand and extend multi-year silicon carbide (SiC) 150mm wafer supply agreement |
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Munich, Germany and Durham, N.C. – January 23, 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a global semiconductor leader in power systems and IoT, and Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, today announced the expansion and extension of their existing long-term 150mm silicon carbide wafer supply agreement, originally signed in February 2018. The extended partnership includes a multi-year capacity reservation agreement. It contributes to Infineon’s general supply chain stability, also with regard to the growing demand for silicon carbide semiconductor products for automotive, solar and EV applications and energy storage systems. |
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| 22.01.2024 15:00 |
Infineon and GlobalFoundries extend long-term agreement with focus on automotive microcontrollers |
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Munich, Germany and Malta, NY, USA – 22 January 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and GlobalFoundries (Nasdaq: GFS) (GF) today announced a new multi-year agreement on the supply of Infineon’s AURIX™ TC3x 40 nanometer automotive microcontrollers as well as power management and connectivity solutions. The additional capacity will contribute to secure Infineon’s business growth from 2024 through 2030. |
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| 17.01.2024 14:15 |
Infineon launches next-generation ZVS flyback converter chipset for advanced USB-C PD adapters and chargers |
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Munich, Germany – 17 January 2024 – The growing popularity of USB-C power delivery (PD) charging increases the demand for compatible chargers. Users now seek powerful yet compact adapters. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) addresses this need with the EZ-PD™ PAG2, a secondary-side controlled ZVS flyback converter chipset. This chipset, comprising EZ-PD PAG2P and EZ-PD PAG2S, integrates USB PD, a synchronous rectifier, and a PWM controller. It ensures efficient communication and isolation between primary and secondary sides using pulse-edge transformer (PET) CYPET121. The chipset supports innovative noncomplementary active-clamp flyback (NCP-ACF) and quasi-resonant flyback with zero voltage switching (QR-ZVS) topologies for enhanced efficiency. This makes it ideal for high-efficiency USB-C adapters, chargers, and travel adapters. |
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