| 12.09.2006 06:00 |
Infineon Officially Opens First Asia-Based Front-End Fab in Malaysia; US $1 Billion Investment Power Plant for Industrial and Automotive Chips |
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Kulim, Malaysia and Munich, Germany - September 12, 2006 - Infineon Technologies AG (NYSE/FSE: IFX) today announced the opening of its first Asia-based front-end power fab located in Kulim Hi-Tech Park, Malaysia. At the ceremony, the Honourable Dato’ Seri Rafidah Aziz, Minister of International ... |
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| 11.09.2006 16:00 |
Comneon Commences High Volume Shipments of its Open License 3G Protocol Stack: Represent the World’s First Openly-Licensable 2G/3G Dual Mode Solution to be Commercially Deployed |
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Munich - September 11, 2006 - Comneon GmbH, a leading supplier of software for mobile phones, today announced that its dual-mode 3G protocol stack is now shipping in high volumes with one of the industry’s Top-3 handset manufacturers. This represents the first configurable 2G/3G dual mode protocol ... |
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| 11.09.2006 13:00 |
Infineon Introduces Highly-Integrated SoC Solutions to Enable Higher Performance, Cost-Optimized VoIP Solutions for Next Generation Residential Gateways |
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Munich, Germany - September 11, 2006 - Infineon Technologies AG (FSE/ NYSE: IFX) today announced a new family of highly-integrated System-on-Chip (SoC) solutions with dual-core architecture and several integrated peripherals. The new TwinPass family targets digital home applications, such as ... |
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| 29.08.2006 14:00 |
IBM, Chartered, Infineon and Samsung Announce Process and Design Readiness for Silicon Circuits on 45nm Low-Power Technology; Industry leaders Offer Reliable, High-Performance, Low Leakage Platform for Early adopters of Leading-Edge Process; Early Design Kits Available to Accelerate Transition |
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East Fishkill, NY; Singapore; Munich and Seoul - August 29, 2006 - IBM, Chartered Semiconductor Manufacturing, Infineon Technologies and Samsung Electronics Co., Ltd. today announced first silicon-functional circuits and the availability of design kits based on their collaboration for 45nm low-power... |
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| 21.08.2006 10:00 |
New US Passports Contain Secure Identification Chips from Infineon; Advanced Technology Meets International Standard for Secure Travel Documents |
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San Jose, Calif. and Munich, Germany – August 21, 2006 – Infineon Technologies AG (NYSE/FSE: IFX) today announced that it received a multi-million piece purchase order from the United States government to supply its highly-secure integrated circuit technology for the new electronic passport. ... |
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| 09.08.2006 15:00 |
Infineon Achieves Industry-Best Performance of Disk Drive Read Channel Based on 90 nm Technology; Core Targeted for SoC Supporting 6 Gbs Hard Disk Serial Interface Standards |
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Munich, Germany/San Jose, Calif. - August 9, 2006 - Infineon Technologies AG (FSE/ NYSE: IFX) today announced it has demonstrated functionality and data rates exceeding 2.6 Gbs (gigabits per second) for a hard disk drive read channel IC (integrated circuit) core, which is the industry’s highest data rate... |
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