Press Releases 1633 to 1638 of 1706
12.06.2006 15:00 Infineon Drives down 3G Mobile Phone Production Cost and Size, Introduces Industry’s First BAW Filters Using Wafer-Level Packaging
San Francisco CA - June 12, 2006 - At the MTT International Microwave Symposium, Infineon Technologies AG (FSE/NYSE: IFX), a leading provider of communication ICs, announced the extension of its BAW (Bulk Acoustic Wave) filter product portfolio for UMTS/W-CDMA cell phones. The complimentary pair of ...
05.06.2006 08:00 Infineon Introduces Vinetic-Plus, World’s First Single-Chip Digital and Analog VoIP Engine; New Chip Enables Small VoIP Adapters for Global Use
Munich - June 5, 2006 - Infineon Technologies AG (FSE/NYSE: IFX) today introduced the world’s first single-chip VoIP (Voice-over-IP) engine with integrated codec and analog telephony interface.  The new Vinetic-Plus paves the way for creation of highly compact and portable VoIP-telephony adapters ...
05.06.2006 08:00 Infineon Launches Breakthrough Single-Chip Home Gateway; Integrates ADSL2+ and Converged Broadband Value Added Services to Reduce System Chip Count Up to 60 Percent
Munich, June 5, 2006 - Infineon Technologies AG (FSE/NYSE: IFX), a leading provider of broadband communications ICs, today announced a single-chip solution for ADSL2+ broadband IAD (integrated access device) and home gateway applications enabling services such as VoIP, video-conferencing and IPTV. ...
30.05.2006 10:30 Infineon Introduces Power Modules Optimized for Industrial Applications, Innovative Design and New Chip Technology Provide 60-Percent Reduction in Stray Inductance and Operating Temperature Extended to +150°C
Munich and Nuremberg, Germany - May 30, 2006 - At the PCIM 2006 exhibition and congress in Nuremberg, Infineon Technologies AG (FSE/NYSE: IFX) today introduced a new family of compact IGBT (Insulated Gate Bipolar Transistor) modules that enable power converter system solutions optimized for various ...
30.05.2006 10:30 Reduced Losses and High Power Cycling Capability at +150 °C Optimize Infineon’s New IHM/IHV B Power Modules for Traction Drives
Munich and Nuremberg - May 30, 2006 - At the PCIM exhibition and congress in Nuremberg, Infineon Technologies AG (FSE/NYSE: IFX) today introduced the first IGBT (Insulated Gate Bipolar Transistor) modules of its IHM/IHV B series. The new modules enable highly efficient power inverter designs for use...
23.05.2006 10:00 Infineon Demonstrates Second Generation Ultra Low-Cost GSM Single-Chip with Successful Live Phone Call
Munich - May 23, 2006 - Infineon Technologies AG today announced that the first E GOLDvoice chip produced in Dresden worked at the first attempt and has already been used to make phone calls on GSM networks. E-GOLDvoice is the most highly integrated chip for mobile telephony, combining all of a mobile ...
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