| 13.06.2007 10:00 |
Infineon Introduces Low-Power CODEC/SLIC Single-Chip for Voice Terminal Applications and VoIP-Enabled PCs |
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Munich, Germany - June 13, 2007 - Infineon Technologies AG (FSE/NYSE: IFX), a leading provider of communication ICs, today introduced the newest member of its DuSLIC® (Dual-channel Subscriber Line Interface Circuit) family of products for voice and VoIP-enabled devices. DuSLIC-xT is an ... |
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| 13.06.2007 08:00 |
Infineon scores a major technological breakthrough - Innovative semiconductor structures greatly improve energy efficiency |
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Munich, Germany - June 13, 2007 - Infineon researchers have unveiled details of a new transistor architecture in Japan today that removes many of the barriers to the production of smaller, more powerful electronic devices and circuits. Known as multi-gate field-effect transistor technology, these ... |
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| 24.05.2007 08:30 |
ZTE Selects Infineon Single-Chip Solution for Ultra-Low Cost Mobile Phones |
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Munich, Germany, May 24, 2007 - Infineon Technologies (FSE/NYSE: IFX) today announced that its ULC2 (second generation ultra-low cost) platform based on the single-chip E-GOLD™voice solution has been selected by ZTE Corporation, a leading China-based telecommunication equipment manufacturer. ... |
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| 23.05.2007 11:30 |
Infineon Chips Ensure 22 Million Daily Contactless Transactions Run Smoothly for Seoul’s Public Transportation System |
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Munich - May 23, 2007 - Infineon Technologies, global market leader in integrated circuits (ICs) for chipcards, today announced that it has been supplying semiconductors to the T-money (Transportation money) project in the greater Seoul area of Korea. This is one of the largest projects worldwide ... |
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| 23.05.2007 09:00 |
Infineon, IBM, Chartered, Samsung, Freescale Expand Technology Agreements - Alliance Partners Will Collaborate to Develop and Manufacture Advanced 32-Nanometer Semiconductors |
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In a move that signals a firm and ongoing commitment to future technology leadership, IBM and its joint-development alliance partners Infineon Technologies AG and Freescale Semiconductor along with its Common Platform™ technology partners Chartered Semiconductor Manufacturing and Samsung ... |
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| 22.05.2007 11:00 |
Infineon Introduces Power Modules PrimePACK Optimized for Industrial Applications and Windmills in Both 1200V and 1700V Voltage Classes |
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Munich and Nuremberg, Germany - May 22, 2007 - The new PrimePACK™ modules of Infineon Technologies AG (FSE/NYSE: IFX) in the 1200V and 1700V voltage classes are up to 45 percent lighter when compared to modules with the same power. Infineon is the sole semiconductor company that has achieved ... |
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