Press Releases 1537 to 1542 of 1712
09.10.2007 12:00 Infineon And Jungo Partner To Deliver Carrier-Grade Residential Gateway Platform
Neubiberg, Germany, and San Jose, CA October 09, 2007 - Infineon Technologies (FSE/NYSE: IFX) and Jungo Ltd., today announced a partnership to deliver production-ready, carrier-grade reference designs for the multi-service residential gateway market. The partnership enables customers to offer complete ...
09.10.2007 12:00 Infineon’s AMAZON-SE ADSL2/ 2+ System-On-a-Chip Wins IEC 2007 InfoVision Award in “Enabling Silicon and Component-Level Technologies” Category
Berlin, Germany, October 9, 2007 - Today, at the Broadband World Forum (BBWF) in Berlin, Infineon Technologies (FSE/NYSE: IFX) received an InfoVision Award from the International Engineering Consortium (IEC). Infineon’s integrated AMAZON-SE ADSL2/ 2+ system-on-a-chip (SoC) was selected as ...
08.10.2007 09:30 DareGlobal Selects Infineon's AMAZON-SE ADSL2/ 2+ System-on-a-Chip
Neubiberg, Germany, October 8, 2007  - Infineon Technologies AG (FSE/NYSE: IFX) a leading supplier of communication ICs, today announced that DareGlobal Technologies Co., Ltd. has selected the Infineon AMAZON-SE System-on-a-Chip (SoC) for its modem/router solutions. ...
02.10.2007 10:30 Infineon and Hosiden Cooperate on Silicon Microphone Activities
Neubiberg, Germany and Osaka, Japan - October 2nd, 2007 - Infineon Technologies AG (FSE, NYSE: IFX) and Hosiden Corporation (TSE, OSE: Hosiden), one of the world’s leading microphone manufacturers, today announced a cooperation on Silicon Microphones activities. Infineon contributes its semiconductor expertise and MEMS...
26.09.2007 15:00 International Rectifier Grants License Agreement for DirectFET® Packaging Technology to Infineon Technologies
Neubiberg, Germany and El Segundo, California - September 26, 2007 - Infineon Technologies (FSE/NYSE: IFX) and International Rectifier, IR® (NYSE: IRF) today announced that Infineon will license from International Rectifier its patented advanced power management packaging technology, DirectFET®...
25.09.2007 08:30 Infineon Signs Agreement with Motorola to Develop 3G Radio Frequency Chip
Neubiberg, Germany - September 25, 2007 - Infineon Technologies AG (FSE/NYSE: IFX) today announced that it has signed an agreement with Motorola to develop a new multi-mode, single-chip 3G radio frequency (RF) transceiver based on Infineon’s SMARTi® UE chip. The RF transceiver is a core ...
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