| 12.12.2007 09:00 |
A new Infineon TVS protection diode, the smallest in the world, guards portable electronics and high-speed data communications from electrostatic discharge |
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Neubiberg, Germany - December 12, 2007 - Infineon, the technology leader in transient voltage suppression (TVS) diodes, today unveiled the smallest component of this type in the world. With a footprint of just 0.6 x 0.3mm² and a mere 0.3mm high, the ESD series diode is designed to protect ... |
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| 06.12.2007 09:00 |
A government-funded project creates the foundations for a faster and more reliable Internet |
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Neubiberg, Germany - December 6, 2007 - The Internet, in its current form, is unable to reliably sustain advanced services like telephony (VoIP) or video on demand. NGN-PlaNetS, a recently completed project headed by Infineon Technologies AG and aided with EUR3.9 million in funding from Germany’s ... |
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| 20.11.2007 09:00 |
Infineon Ships One Billionth RF transceiver – Approximately Every Fourth Mobile Phone Worldwide Includes Infineon’s RF Solutions |
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Neubiberg, Germany – November 20, 2007 – Over one billion RF transceivers, miniature radio frequency chips that establish the radio link between mobile phone and the base station, have been shipped to date by Infineon Technologies, a leading supplier of communication ICs. Last year the figure stood... |
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| 20.11.2007 09:00 |
Infineon Ships One Billion RF-Transceivers; Introduces Next-Generation LTE Chip |
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Neubiberg, Germany, November 20, 2007 – Infineon Technologies AG (FSE/ NYSE: IFX), a leading supplier of communication ICs, today announced it has shipped its one billionth RF transceiver. With more than 230 million handset transceivers shipped in 2006, Infineon holds the leading market share in a ... |
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| 14.11.2007 07:30 |
Infineon reports results for the fourth quarter and the 2007 fiscal year |
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Neubiberg, Germany - November 14, 2007 - Infineon Technologies AG (FSE/NYSE:IFX) today reported results for the fourth quarter, ended September 30, and for the full 2007 fiscal year. ... |
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| 13.11.2007 10:15 |
Infineon Announces Technology Collaboration with Intel to Develop High-Density SIM Card Solutions |
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Paris, France and Neubiberg, Germany - November 13, 2007 - Today at the Cartes Trade Show in Paris, Infineon Technologies AG (FSE, NYSE: IFX) announced a strategic technology collaboration for the development of optimized chip solutions for high-density (HD) SIM cards with Intel Corporation. ... |
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