| 17.11.2009 09:30 |
Infineon Provides Contactless Excellence for ID and Payment Applications: New SLE 78CL Dual-Interface Chip Card Microcontroller Family Incorporates Revolutionary Security Features |
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Neubiberg, Germany and Paris, France - November 17, 2009 - Confirming its continued innovation in contactless excellence, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today at the "Cartes & Identification" Trade Show introduced a high-security dual-interface microcontroller family that ... |
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| 17.11.2009 09:30 |
Infineon and ARM Announce Strategic Architectural License Agreement for Advanced Security Applications |
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Neubiberg, Germany and Cambridge, UK - November 17, 2009 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and ARM (LSE: ARM /Nasdaq: ARMH) announced today a long-term strategic collaboration in the field of security controllers for chip card and security applications. Based on the agreement, ... |
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| 11.11.2009 13:45 |
China Selects Infineon’s Security Chips for Electronic Passports |
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Neubiberg, Germany - November 11, 2009 - The Chinese government is using security microcontrollers of Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) for its new electronic passports. Infineon today announced that it recently started deliveries to the Chinese electronic passport project which ... |
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| 06.11.2009 15:50 |
Infineon completes the sale of Wireline business; Lantiq becomes a stand alone company |
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Neubiberg, Germany - November 6, 2009 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Lantiq today announced the closing of the sale of Infineon’s Wireline business to Lantiq, an affiliate of the U.S. based investor Golden Gate Capital. ... |
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| 05.11.2009 07:30 |
Infineon and TSMC Extend Technology and Production Partnership Agreement; Will Jointly Develop 65nm Embedded Flash Process Technology For Automotive and Chip Card Applications |
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Neubiberg, Germany and Hsinchu, Taiwan, R.O.C. - November 5, 2009 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Taiwan Semiconductor Manufacturing Company (TWSE: 2330, NYSE: TSM) today announced that they are extending their development and production partnership to a 65nanometer (nm) ... |
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| 04.11.2009 10:00 |
More Efficient Electronics by Means of Chip-Mounted Capacitors; "MaxCaps" Research Project Launched Under the Leadership of Infineon |
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Neubiberg, Germany - November 4, 2009 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) was named as the project coordinator for the five participating German partners in a new pan-European research project aimed at making electronic devices more compact and more efficient. ... |
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