| 30.06.2008 15:30 |
Infineon and the German Federal Ministry of the Interior Widen Security Cooperation to Include Certification and Identity Documents |
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Neubiberg and Berlin, Germany - June 30, 2008 - Germany’s Federal Ministry of the Interior (BMI) and semiconductor manufacturer Infineon Technologies are to continue working together in the area of IT security. Federal Minister of the Interior Dr. Wolfgang Schäuble and Infineon’s CEO Peter Bauer ... |
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| 17.06.2008 14:15 |
Infineon Introduces World`s First 1.8V Broadband Low Noise Amplifier to Support Portable TV and Mobile TV Systems |
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Neubiberg, Germany and Atlanta, Georgia, USA - June 17, 2008 - Today at the IEEE MTT-S International Microwave Symposium 2008 (IMS2008), Infineon Technologies AG (FSE/NYSE: IFX) announced the availability of the company’s new low noise amplifier (LNA), one of the industry’s smallest broadband LNAs ... |
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| 17.06.2008 14:15 |
New Infineon RF Power Transistors Offer Highest Peak Power in 700 MHz Band |
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Neubiberg, Germany and Atlanta, USA - June 17, 2008 - At the IEEE MTT-S International Microwave Symposium here today, Infineon Technologies AG (FSE/NYSE: IFX), a leading supplier of communication ICs and solutions, announced a new family of RF power transistors specifically targeted at wireless ... |
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| 17.06.2008 14:15 |
Infineon Announces Industry’s First High-Performance LDMOS RF Power Transistors in Copper-Based Open-Cavity Plastic Packages for RoHS-Compliant Designs |
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Neubiberg, Germany and Atlanta, USA - June 17, 2008 - At the IEEE MTT-S International Microwave Symposium today, Infineon Technologies AG (FSE/NYSE: IFX) announced a new family of RF power transistors in an innovative open-cavity plastic package with a copper base. The new EPOC® (Enhanced Plastic ... |
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| 16.06.2008 15:00 |
Infineon Introduces World’s Highest Integrated VoIP Solution for Next Generation Access Applications |
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Las Vegas, USA and Neubiberg, Germany - June 16, 2008 - Today at the NXTcomm 2008 Show, Infineon Technologies AG (FSE/NYSE: IFX), a leading provider of communication ICs, introduced the VINETIC™-SVIP, a new family of devices developed for next-generation VoIP access applications. By enhancing the... |
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| 30.05.2008 09:30 |
Infineon Introduces World's Smallest 3G Solutions for Cost Efficient HSDPA to High-end HSUPA Phones |
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Neubiberg, Germany - May 30, 2008 - Infineon Technologies AG (FSE/NYSE: IFX) today announced the availability of its new generation 3G platform family. This new platform family addresses all major 3G market segments and includes a high performance HSPA modem solution, a feature phone solution ... |
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