| 22.02.2010 16:00 |
Infineon Drives Innovation in LED Lighting; New Off-Line LED Drive Design Provides High Efficiency and Exceptional Power Quality for Incandescent Bulb Replacement |
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Neubiberg, Germany and Palm Springs, Calif. – February 22, 2010 – Today at the Applied Power Electronics Conference (APEC), Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduced its specific off-line driver IC for high-efficiency LED bulbs with dimming for residential lighting... |
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| 22.02.2010 12:00 |
Infineon Files Patent Infringement Lawsuit Against Elpida Memory |
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Neubiberg, Germany – February 22, 2010 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that the company and its subsidiary Infineon Technologies North America Corp. have filed a complaint with the U.S. International Trade Commission (ITC) against Elpida Memory Inc. on February 19... |
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| 15.02.2010 13:45 |
Infineon Introduces Entry-Level Platform for Android™ Handsets to Drive Smartphones into the High Volume Segment |
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Neubiberg, Germany and Barcelona, Spain - February 15, 2010 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today at the Mobile World Congress 2010 announced XMM™6181, a new entry-level smartphone platform for Android handsets addressing the high volume consumer segment. ... |
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| 15.02.2010 13:45 |
Infineon and Vodafone to Collaborate on Next Generation GSM and EDGE Technologies to Enable Mobile Internet for the Emerging Markets |
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Neubiberg, Germany and Barcelona, Spain - February 15, 2010 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced its collaboration with Vodafone Group Plc, the world’s leading mobile telecommunications company. This collaboration will expand the strategic partnership of both ... |
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| 15.02.2010 13:45 |
New XMM™2138 Platform from Infineon Supports Growing Dual-SIM Market |
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Neubiberg, Germany and Barcelona, Spain - February 15, 2010 - To address the growing Dual-SIM (Subscriber Identity Module) market Infineon Technologies (FSE: IFX / OTCQX: IFNNY) today launched its new XMM™2138 platform, supporting Dual-SIM operation. Dual-SIM mobile phones enable simultaneous ... |
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| 15.02.2010 13:45 |
Infineon Introduces World's Smallest HSPA+ Solution for 3G Smart Phones |
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Neubiberg, Germany and Barcelona, Spain - February 15, 2010 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today at the Mobile World Congress 2010 announced the availability of XMM™6260, the latest platform in its 3G slim-modem family. The XMM 6260 platform is optimized as a slim-modem ... |
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