| 05.05.2010 09:00 |
Infineon Breaks Switching and Efficiency Limits with 3rd Generation High Speed 600 V and 1200 V IGBTs |
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Neubiberg, Germany - May 5, 2010 - Infineon Technologies today introduced its 600V and 1200V High Speed 3 (3rd generation) IGBT product family optimized for high frequency and hard switching applications. The device family sets a new benchmark in reduced switching losses and best-in-class efficiency ... |
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| 04.05.2010 12:15 |
Infineon Ranks First in Chips for Automotive Electronics |
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Neubiberg, Germany - May 4, 2010 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has advanced to become the world’s foremost supplier of chips for automotive electronics, according to the most recent study published by Strategy Analytics. The U.S.-based market researcher reports that Infineon ... |
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| 04.05.2010 09:00 |
New .XT-technology from Infineon Significantly Increases Lifetime of IGBT Modules and Opens the Path for Higher Junction Temperature up to 200°C |
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Neubiberg - May 04, 2010 - Infineon Technologies today at PCIM Europe 2010 in Nuremberg (May 4-6, 2010) introduces an innovative IGBT internal packaging technology, which significantly increases the lifetime of IGBT modules. The new .XT technology optimizes all interconnections within an IGBT ... |
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| 03.05.2010 14:00 |
Infineon Technologies and Mitsubishi Electric Team Up to Serve the Global Power Electronics Industry |
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Neubiberg, Germany - May 3, 2010 - Infineon Technologies and Mitsubishi Electric Corporation agreed to establish a service agreement by which they will both serve the industrial motion controls and drives market worldwide as sources for the advanced IGBT module packages SmartPACKs and SmartPIMs. ... |
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| 03.05.2010 11:15 |
Infineon introduces new ThinPAK 8x8 leadless SMD package for HV Power MOSFETs designed to enable higher power density solutions |
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Neubiberg, Germany – May 3, 2010 – Infineon Technologies today introduces the ThinPAK 8x8, a new leadless SMD package for HV MOSFETs. The new package has a very small footprint of only 64mm² (vs. 150mm² for the D2PAK) and a very low profile with only 1mm height (vs. 4.4mm for the ... |
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| 28.04.2010 07:32 |
Infineon updates FY 2010 guidance: Revenue now forecast to grow by a high 30's percentage, with combined Segment Result margin of more than ten percent - Strong second quarter results with 10.6 percent Segment Result margin |
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Neubiberg, Germany - April 28, 2010 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today reported results for the second quarter of the 2010 fiscal year, ended March 31, 2010. ... |
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