| 18.06.2010 15:25 |
Infineon Announces Production of Security Chips in U.S. Foundry; IBM Burlington Plant Qualified to Supply Security Chips for Secure Government ID Programs |
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Neubiberg, Germany - June 18, 2010 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that IBM (NYSE: IBM) will manufacture Infineon-designed highly-secure integrated circuits (ICs) used for secure identification applications, including electronic passports compliant with ... |
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| 15.06.2010 11:00 |
Infineon Ushers in a New Era in Hardware-Based Security: German Federal Office for Information Security Affirms Outstanding Security Performance of SLE 78 Security Controllers with Revolutionary "Integrity Guard" Technology |
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Neubiberg, Germany - June 15, 2010 - Infineon Technologies (FSE: IFX / OTCQX: IFNNY) today announced that its SLE 78 family of security controllers received security certification for use in electronic ID documents and chip card applications. The Germany Federal Office for Information Security (BSI)... |
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| 20.05.2010 10:00 |
Infineon and Elpida Settle Legal Dispute |
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Neubiberg, Germany - May 20, 2010 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that it has settled its patent infringement claim against Elpida Memory Inc., and both Infineon and Elpida have agreed to seek dismissal of all pending patent infringement cases. ... |
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| 14.05.2010 11:00 |
Infineon Is World’s First Semiconductor Provider to Receive the Highest Level Quality Award from Toyota Hirose Plant |
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Neubiberg, Germany and Tokyo, Japan - May 14, 2010 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that the Hirose plant of the Toyota Motor Corporation awarded Infineon the "Honor Quality Award", its highest level award for delivering extraordinary product quality. ... |
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| 05.05.2010 09:00 |
Infineon Makes 2nd Generation of its ThinQ! Silicon Carbide Schottky Diodes Available in Fully Isolated TO-220 FullPAK Package |
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Neubiberg, Germany - May 5, 2010 - Infineon Technologies today announced the availability of its 2nd generation SiC (Silicon Carbide) Schottky diodes in the TO-220 FullPAK package. The new TO220 FullPak portfolio combines the high electrical performance standards of the 2nd generation ThinQ! ... |
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| 05.05.2010 09:00 |
Infineon Presents new Compact IGBT Modules PrimePACK 3 and EconoDUAL 3 with Highest Power Density and Reliability |
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Neubiberg, Germany - May 5, 2010 - At the PCIM Europe 2010 in Nuremberg (May 4-6, 2010), Infineon Technologies presents new IGBT modules designed for highest power density and reliability: a PrimePACK™ module with 1400A in 1700V in a PrimePACK 3 packaging, and the new flagship of the EconoDUAL ... |
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