| 08.05.2012 09:00 |
Infineon Releases Revolutionary CoolSiC™ 1200V SiC JFET Family with Direct Drive Technology: Efficiency Levels for Solar Inverters Scale New Dimensions |
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Nuremberg, Germany - May 8, 2012 - Today at the PCIM Europe 2012 trade show, Infineon Technologies (FSE: IFX / OTCQX: IFNNY) introduced the new CoolSiC 1200V SiC JFET family, which strengthens Infineon’s market leadership in the SiC (Silicon Carbide) product segment. ... |
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| 03.05.2012 07:32 |
Infineon resumes growth - profit margin better than expected |
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Neubiberg, Germany - May 3, 2012 - Infineon Technologies AG today reported results for the second quarter of the 2012 fiscal year, ended March 31, 2012. ... |
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| 25.04.2012 11:00 |
Infineon Introduces Superjunction 500V CoolMOS CE Products for Consumer and Lighting Applications: Industry’s Best Price-Performance Ratio |
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Neubiberg, Germany - April 25, 2012 - Infineon Technologies (FSE: IFX / OTCQX: IFNNY) today introduced the 500V CoolMOS CE, a new series of CoolMOS products. When used to design power supplies in price sensitive applications such as consumer electronics, PC Silverboxes and Lighting SMPS ... |
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| 17.04.2012 10:00 |
Cappuccino and Croissant? Just Tap and Go: Infineon’s Security Chip for Europe’s Biggest Contactless Bank Card Project |
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Neubiberg, Germany - April 17, 2012 - Long waits and rummaging for small change to pay for coffee and a newspaper on the way to work? Potentially a thing of the past in Germany’s metropolitan area Hanover, Braunschweig and Wolfsburg: There, the German Banking Industry Committee (Deutsche Kreditwirtschaft) today launches its "girogo" project... |
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| 13.04.2012 12:30 |
High-Productivity Development Support for Infineon XMC4000 Microcontrollers on Hand: DAVE 3 Development Environment Available for Free Download |
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Neubiberg, Germany - April 13, 2012 - Offering comprehensive and efficient development support for its XMC4000 industrial microcontroller family Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced download availability of its DAVE 3 integrated development platform environment. ... |
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| 03.04.2012 12:30 |
Fairchild Semiconductor and Infineon Technologies Reach License Agreement for Innovative Automotive MOSFET H-PSOF TO-Leadless Packaging Technology; Agreement Provides Designers Reliable Sources for Innovative Package |
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Neubiberg, Germany, and San Jose, Calif. - April 3, 2012 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Fairchild Semiconductor Corp. (NYSE: FCS) today announced a licensing agreement on Infineon’s advanced automotive MOSFET packaging technology H-PSOF ... |
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