| 02.05.2013 07:43 |
Second-quarter revenue and Segment Result significantly above previous quarter |
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Neubiberg, Germany - May 2, 2013. Infineon Technologies AG today reported results for the second quarter of the 2013 fiscal year, ended March 31, 2013. ... |
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| 30.04.2013 11:10 |
Successful Market Launch of Heat Conducting Paste TIM - Rapid Expansion of Range to other Product Groups |
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Neubiberg, April 30, 2013 - The Thermal Interface Material (TIM) developed by Infineon Technologies AG for the reduction of contact resistance between the metal surface of power semiconductors and the heat sink has been launched successfully. Using the EconoPACK™ + of the new D Series, customers ... |
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| 29.04.2013 11:40 |
Infineon and GLOBALFOUNDRIES Announce Joint Development and Production Collaboration for 40nm Embedded Flash Process Technology |
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Neubiberg / Dresden, Germany and Singapore - April 29, 2013 - Infineon Technologies (FSE: IFX / OTCQX: IFNNY) and Globalfoundries Inc. today announced a joint technology development and production agreement for 40 nanometer (nm) embedded flash (eFlash) process technology. The cooperation will focus ... |
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| 26.04.2013 11:40 |
Largest Research Project to Strengthen Europe’s Role as Semiconductor Production Site Kicked-Off Today at Infineon in Villach |
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Neubiberg, Germany / Villach, Austria - April 26, 2013 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is hosting a two-day meeting at its Villach site to kick-off one of the largest European research projects focused on advancing industrial production capability. The research project, ... |
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| 25.04.2013 14:10 |
With its TLE496x Series, Infineon offers Hall Sensors of High Precision and High Energy Efficiency in Ultra Small SOT23 Packages |
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Neubiberg, Germany - April 25, 2013 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched Hall Sensors aimed at automotive and industrial applications demanding the highest precision, the lowest energy consumption and the smallest space requirements. ... |
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| 16.04.2013 10:10 |
Infineon Introduces SiGe Transceiver Family for Millimeter Wave Wireless Backhaul; Single-Chip ICs Simplify Design of Small Cell Backhaul Links |
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Neubiberg, Germany - April 16, 2013 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced a new transceiver family that simplifies system design and production logistics by replacing more than 10 discrete devices. Due to their low power consumption the single-chip high-integration ... |
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