| 01.10.2013 15:15 |
Infineon Ramps Production of Chipsets for Millimeter Wave Backhaul; Several Gigabit Data Transfer Rate Covers Worldwide Operator Requirements |
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Neubiberg, Germany - October 1, 2013 - Infineon Technologies has started the production of its BGTx0 chipsets for wireless backhaul communication systems. The transceiver family provides a complete radio frequency (RF) front-end for wireless communication in 57-64 GHz, 71-76 GHz, or 81-86 GHz millimeter wave bands. ... |
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| 30.09.2013 14:15 |
Fast Route to Safety-Compliant Appliances: Free VDE Certified Library for XMC Microcontrollers Satisfies IEC60730 Class B Standard |
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Neubiberg, Germany - September 30, 2013 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the availability of a free VDE certified IEC 60730 self-test library for its XMC1000 and XMC4000 families of industrial 32-bit microcontrollers. ... |
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| 12.09.2013 13:15 |
Infineon again one of the most sustainable companies in the world |
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Neubiberg, Germany - September 12, 2013 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has been included in the Dow Jones Sustainability Index for the fourth time in a row, the Swiss investment company RobecoSAM announced today. Since its initial application in 2010, Infineon has continually ... |
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| 10.09.2013 15:45 |
Infineon Advances Trusted Computing with New OPTIGA™ TPM Family: Security Chips Serve Industrial/Embedded Environments and Support Next Generation TPM 2.0 Firmware |
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Neubiberg, Germany - September 10, 2013 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced a new family of Trusted Platform Modules (TPM) that broaden the application base for Trusted Computing and mark the first availability of discrete security chips supporting the next generati... |
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| 21.08.2013 10:15 |
Successful Research Enables Further Miniaturization of Microelectronic Systems in Automobiles and Industrial and Communications Electronics |
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Neubiberg, Germany - August 21, 2013 - The largest research project in Europe for researching and developing highly integrated system-in-package solutions has been successfully completed. The ESiP (Efficient Silicon Multi-Chip System-in-Package Integration) project partners have worked out future ... |
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| 19.08.2013 10:15 |
Infineon presents new module in the 4.5 kV voltage class – IHV product family now complete |
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Neubiberg, August 19, 2013 - Reliable and robust with lower conduction and switching losses and the highest power density: those are the exceptional properties of the new 4.5kV IHV module of Infineon Technologies AG. The highly insulating 6.5 kV housing offers enhanced protection by means of greater... |
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