| 14.05.2013 10:10 |
Infineon Introduces EconoDUAL™ 3 Power Modules with Automotive Qualification, Offering Both Highest Power Density and Reliability |
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Neubiberg / Nuremberg, Germany – May 14, 2013 – At PCIM Europe 2013 in Nuremberg (May 14-16, 2013), Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches its new EconoDUAL™ 3 IGBT modules, which are fully qualified according to automotive standards. The new offering addresses demanding applications... |
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| 07.05.2013 12:25 |
Infineon Adds Compact Class to EiceDRIVER™ Family - New 2EDL EiceDRIVER™ Supports a Multitude of Power Applications |
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Neubiberg, Germany - May 7, 2013 - Next week at the PCIM 2013 trade show for power electronics, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will present the new 2EDL EiceDRIVER™ Compact half-bridge gate driver, which is intended for applications with a blocking voltage of 600 Volts. Equipped ... |
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| 06.05.2013 15:20 |
Infineon Introduces TO 247-4 pin Package for CoolMOS™ MOSFETs; Significant Efficiency Improvements in Hard Switching Topologies |
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Neubiberg, Germany - May 6, 2013 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced a TO 247-4 pin package. The added fourth pin acts as a Kelvin source to effectively reduce the parasitic inductance of the source lead of the power MOSFET. ... |
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| 06.05.2013 10:10 |
Infineon Introduces CoolMOS™ C7; Significant Step in Superjunction Technology Bringing the World’s Lowest RDS(on) to Hard Switching Applications |
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Neubiberg, Germany - May 6, 2013 - Infineon Technologies (FSE: IFX / OTCQX: IFNNY) expands its High Voltage portfolio with CoolMOS™ C7, introducing a new 650V Superjunction MOSFET technology. ... |
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| 02.05.2013 07:43 |
Second-quarter revenue and Segment Result significantly above previous quarter |
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Neubiberg, Germany - May 2, 2013. Infineon Technologies AG today reported results for the second quarter of the 2013 fiscal year, ended March 31, 2013. ... |
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| 30.04.2013 11:10 |
Successful Market Launch of Heat Conducting Paste TIM - Rapid Expansion of Range to other Product Groups |
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Neubiberg, April 30, 2013 - The Thermal Interface Material (TIM) developed by Infineon Technologies AG for the reduction of contact resistance between the metal surface of power semiconductors and the heat sink has been launched successfully. Using the EconoPACK™ + of the new D Series, customers ... |
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