Press Releases 1105 to 1110 of 1781
13.04.2015 12:00 Infineon and Fraunhofer Present Security Solution for PLC-based Industrial Automation Systems
Munich and Hanover, Germany – April 13, 2015 – The digitalization and increasing networking of production require significantly higher security standards in industrial automation than has it previously been. Digital threats based on malware, incorrect firmware updates, and counterfeit components can...
17.03.2015 10:15 Infineon Unveils Portfolio of Energy-Efficient Enhancement Mode and Cascode configuration GaN-on-Silicon Platforms at APEC 2015
Munich, Germany, and Charlotte, USA – March 17, 2015 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the expansion of its Gallium Nitride (GaN)-on-Silicon technology and product portfolio. The company now offers both enhancement mode and cascode configuration GaN-based platforms...
12.03.2015 12:30 Infineon Introduces OptiMOS™ 5 25V and 30V Product Family, Exceeding 95% Efficiency, Delivering Highest Power Density for Voltage Regulator Solutions
Munich, Germany – March 12, 2015 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced the OptiMOS 5 25V and 30V product family, the next generation of Power MOSFETs in standard discrete packages, a new class of power stages named Power Block, and in an integrated power stage, DrMOS...
10.03.2015 07:15 Infineon and Panasonic Will Establish Dual Sourcing for Normally-Off 600V GaN Power Devices
Munich, Germany, and Osaka, Japan - March 10, 2015 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Panasonic Corporation (TSE: 6752) have announced an agreement under which both companies will jointly develop Gallium nitride (GaN) devices based on Panasonic’s normally-off (enhancement mode)...
03.03.2015 13:45 Infineon Supplies Embedded Secure Element Chip for New Samsung Galaxy S6 and S6 edge Smartphones
Munich, Germany and Barcelona, Spain – March 3, 2015 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that it supplies the embedded Secure Element (eSE) chip for the new premium smartphones Samsung Galaxy S6 and S6 edge. Infineon’s SLE 97 is a SOLID FLASH™-based eSE chip which ...
02.03.2015 09:15 Infineon Introduces embedded Secure Elements for Advanced Mobile Communications
Munich, Germany and Barcelona, Spain – March 2, 2015 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced its new embedded security controllers for premium handsets and smart wearables at Mobile World Congress 2015. The new members of the SOLID FLASH-based SLE 97 product family p...
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