Press Releases 1033 to 1038 of 1785
11.04.2016 15:40 bauma 2016: Infineon increases safety and efficiency in trucks and construction vehicles and enables platooning
Munich, Germany – April 11, 2016 – Radar systems in trucks and construction vehicles play an important role in increasing the safety of road transport. Because they monitor blind spots, alert drivers if they come too close to other road users and automatically initiate the braking process in case of...
11.04.2016 13:15 Infineon Successfully Completes $935 Million US private placement
Munich, Germany – April 11, 2016 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has successfully completed a $935 million US private placement of notes. This is the first such transaction in the company’s history. The proceeds of the transaction will replace the five-year US Dollar term loan g...
04.04.2016 15:15 Lenovo selects embedded security solutions from market leader Infineon
Munich, Germany – April 4, 2016 – The new Lenovo ThinkPad® notebooks will be equipped with OPTIGA™ TPM (Trusted Platform Module) chips by Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY). The world's leading PC manufacturer thus responds to an increase of networking and associated security risks...
22.03.2016 12:30 Infineon scores in Multiphase Power Systems with Integrated Power Stage for servers and other demanding systems
Munich, Germany and Long Beach, USA – March 22, 2016 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced its integrated power stage family. With power efficiency rating reaching 96 percent, the new power stage devices can be combined with Infineon’s latest generation digital PWM po...
21.03.2016 13:45 Infineon presents world’ smallest plug-and-play NFC security module for smart wearables
Munich, Germany and Beijing, China – March 21, 2016 – From fitness trackers and smart keys to chains, watches or wristbands – smart wearables of all kinds are increasingly including mobile payment functionality. Wearable manufacturers are thus challenged to equip even the smallest of devices with se...
11.03.2016 15:00 CoolMOS™ CE in SOT-223 package as cost-effective drop-in replacement for DPAK
Munich, Germany – March 11, 2016 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is growing the portfolio of CoolMOS™ CE with a SOT-223 package. For Infineon’s CoolMOS, this package offers a cost effective alternative to DPAK as well as space savings in some designs with low power dissipation. ...
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