| 11.03.2016 15:00 |
CoolMOS™ CE in SOT-223 package as cost-effective drop-in replacement for DPAK |
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Munich, Germany – March 11, 2016 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is growing the portfolio of CoolMOS™ CE with a SOT-223 package. For Infineon’s CoolMOS, this package offers a cost effective alternative to DPAK as well as space savings in some designs with low power dissipation. ... |
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| 07.03.2016 10:00 |
TTTech and Infineon to speed up the development in autonomous driving |
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Munich, Germany and Vienna, Austria – March 7, 2016 – Under the guidance of AUDI AG, TTTech developed the central platform control unit “zFAS” integrating various functionalities of advanced driver assistance systems (ADAS). The ECU also enables comprehensive fusion of sensor data. Microcontrollers ... |
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| 04.03.2016 14:00 |
How to save Sweden’s annual power consumption in the kitchen |
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Munich, Germany – March 4, 2016 – Simply switch off the light from time to time? A host of useful ideas for saving energy are circulated for the World Energy Efficiency Day on March 5. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) shows how a new technology turns household power guzzlers into... |
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| 02.03.2016 15:45 |
Infineon multimode flyback controller improves performance and drives down power consumption in mid- to high-end LED lighting designs |
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Munich, Germany – March 2, 2016 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today launched a multimode flyback controller IC for LED applications. It can shorten ‘time-to-light’, lower component counts and reduce operational and standby power consumption. Designed to meet the performance an... |
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| 29.02.2016 15:15 |
Infineon and Partners Demonstrate IoT Security at RSA Conference 2016 |
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Munich, Germany and San Francisco, USA – February 29, 2016 – Increasingly important for the success of IoT (Internet of Things) development are the ease-of-use in system design and implementation paired with the robust nature of hardware-based security. The demand is large: IHS Technology forecasts ... |
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| 23.02.2016 14:10 |
Mobile World Congress 2016: Infineon brings bank-level security to smart devices and mobile payment solutions |
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Munich, Germany and Barcelona, Spain – February 23, 2016 – Building on consumers’ trust is essential for payment solutions with smart and mobile devices. As one of the world’s largest suppliers of security chips, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) brings its expertise to advance ... |
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