Press Releases 1021 to 1026 of 1711
19.05.2015 13:15 Infineon Launches new High-Power, Light-Triggered Thyristor with Industry’s First Integrated Protection Features
Munich, Germany – May 19, 2015 – Infineon Technologies Bipolar GmbH & Co. KG has further extended its family of bipolar semiconductors with an optically triggered thyristor that can improve the reliability, lower the system cost and simplify the design of ultra-high-power applications. Infineon’s ne...
19.05.2015 10:15 Infineon’s Next Generation CoolMOS™ Delivers 50 Percent Improved Switching Losses; EiceDRIVER™ is Setting New Standards in System Robustness
Munich, Germany - May 19, 2015 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched a new family of CoolMOS™ C7 series superjunction (SJ) MOSFETs. The 600 V series offers a 50 percent reduction in turn-off losses compared to the CoolMOS™ CP, offering a GaN-like level of performance in ...
19.05.2015 09:15 Infineon Started World’s First Volume Production of Next Generation Automotive Power MOSFETs on 300-Millimeter Thin-Wafer Technology
Munich, Germany – May 19, 2015 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is the first company worldwide manufacturing automotive power MOSFETs on 300-millimeter thin wafers. The first product family OptiMOS™ 5 40V is optimized for CO2 reduction applications. The products are manufactured ...
18.05.2015 10:15 Infineon Launches Intelligent Power Module MIPAQ™ Pro with Smart Protection; Enables Reliable and Compact Inverter Designs in IoT Set-ups
Munich, Germany – May 18, 2015 – At this year's PCIM 2015 trade show Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will launch a new Intelligent Power Module (IPM). The MIPAQ™ Pro provides an all-in-one solution for a wide spectrum of scalable and compact inverter designs to be implemented ...
12.05.2015 14:15 PrimePACK™ Combines latest IGBT5 with .XT Interconnection Technology for Higher Lifetime and Power Density
München, 12. Mai 2015 – Auf der diesjährigen PCIM 2015 präsentiert die Infineon Technologies AG PrimePACK Leistungsmodule, die von der neuesten Generation der Infineon IGBTs profitieren. Die Kombination aus IGBT5-Chips und der innovativen .XT-Aufbau- und Verbindungstechnologie markiert einen ...
12.05.2015 11:45 Infineon 3D Magnetic Sensor with High Accuracy Reduces Power Consumption in Consumer and Industrial Applications
Munich, Germany – May 12, 2015 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced its 3D magnetic sensor TLV493D-A1B6 that features highly accurate three-dimensional sensing with extremely low power con-sumption in a small 6-pin TSOP package. Magnetic field detection in x, y, and ...
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