28.07.2015 09:45 |
Safe Through Night and Fog: Market Leader Infineon Delivers Ten Millionth Radar Chip for Cars |
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Munich, Germany – July 28, 2015 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced that it has shipped its ten millionth high-frequency radar chip. The 77-GHz chips are used in radar-based driver assistance systems that recognize objects at ranges of up to 250 meters. Infineon estimates ... |
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20.07.2015 15:15 |
Embedded Security Made Easy: Protection from Product Piracy and IP Theft for Capital Equipment |
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Munich, Germany – July 20, 2015 – Industrial automation, medical equipment, electronic components – plagiarism of capital equipment requires effective prevention, such as embedded security solutions from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY). According to the OECD, counterfeiting and ... |
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20.07.2015 12:45 |
New Infineon MOSFETs deliver highest energy efficiency in space constrained applications like Power Tools and E-Bikes |
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Munich, Germany – July 20, 2015 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched a new family of StrongIRFET MOSFETs for DC powered circuits including battery powered circuits, brushed and brushless DC (BDLC) motor drives. The MOSFETs can bring highest energy efficiency to ... |
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14.07.2015 12:15 |
German Chancellor Angela Merkel visits state-of-the-art chip manufacturing plant of Infineon Dresden |
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Dresden, July 14, 2015 – German Chancellor Dr. Angela Merkel visited Infineon Technologies Dresden GmbH today as part of her tour through the Dresden microelectronics cluster. She was accompanied by the Federal Minister of Education and Research Prof. Dr. Johanna Wanka and the Prime Minster ... |
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07.07.2015 11:45 |
IR HiRel Launches Compact DC-DC Converter Rated at 185 °C Optimized for Downhole Tools for Oil and Gas Exploration |
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Munich, Germany – July 7, 2015 – IR HiRel, an Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) company, today announced the introduction of the HiRel HTB28 series, the industry’s first hermetic hybrid DC-DC converters rated at 185 ºC in a 1 inch wide package. The new devices are designed ... |
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02.07.2015 16:00 |
“NewP@ss” Research Project Developed Security Technologies for Next Generation ePassports and eGovernment Applications |
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Munich, Germany – July 2, 2015 – Contactless, multifunctional, fast and secure features are important requirements for the new generation of travel documents. The main challenge lies in the combination of security and convenience: travelers should be able to pass through border checkpoints even more... |
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