| Press Releases 7 to 12 of 252 |
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| 25.09.2025 09:00 |
ROHM and Infineon collaborate on silicon carbide power electronics packages to enhance flexibility for customers |
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Kyoto, Japan and Munich, Germany, September 25, 2025 - ROHM and Infineon Technologies AG have signed a Memorandum of Understanding to collaborate on packages for silicon carbide (SiC) power semiconductors used in applications such as on-board chargers, photovoltaics, energy storage systems, and AI data centers. Specifically, the partners aim to enable each other as second sources of selected packages for SiC power devices, a move which will increase design and procurement flexibility for their customers. In the future, customers will be able to source devices with compatible housings from both ROHM and Infineon. The collaboration will ensure seamless compatibility and interchangeability to match specific customer needs. |
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| 16.09.2025 14:00 |
ROHM Launches 2-in-1 SiC Molded Module “DOT-247” |
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Willich-Münchheide, Germany, September 16, 2025 – ROHM has developed the "DOT-247," a 2-in-1 SiC molded module (SCZ40xxDTx, SCZ40xxKTx), ideal for industrial applications such as PV inverters, UPS systems, and semiconductor relays. The module retains the versatility of the widely adopted "TO-247" package while achieving high design flexibility and power density. |
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| 09.09.2025 14:00 |
ROHM has Developed Ultra-Compact CMOS Op Amp: Delivering Industry-Leading* Ultra-Low Circuit Current |
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Willich-Münchheide, Germany, September 09, 2025 – ROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current. This IC is optimized to be applied as a measurement sensing amplifier in size-constrained applications such as handheld measurement instruments, wearable devices, and indoor motion detectors. |
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| 04.09.2025 09:30 |
ROHM’s SiC MOSFETs Adopted in Schaeffler’s Inverter Brick: Now in Mass Production |
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ROHM and Schaeffler, a leading German automotive supplier, have started mass production of a new high-voltage inverter brick equipped with ROHM’s SiC (silicon carbide) MOSFET bare chips as part of their strategic partnership. The inverter brick is intended for a major Chinese car manufacturer. |
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| 21.08.2025 14:00 |
ROHM Releases a New Compact PFC + Flyback Control Reference Design for Power |
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Willich-Münchheide, Germany, August 21, 2025 – ROHM’s new reference design (REF67004) is capable of controlling two commonly used power converter types in consumer and industrial power supply applications by using a single MCU: critical conduction mode PFC (Power Factor Correction) and quasi-resonant flyback. This is part of ROHM’s LogiCoA Power Supply Solution, that leverages analog-digital hybrid control technology. It combines an analog-controlled power stage circuit featuring ROHM’s superior silicon MOSFETs and gate driver ICs with a digitally managed power supply circuit built around the low-power LogiCoA MCU. |
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| 10.07.2025 14:00 |
ROHM Releases New Level 3 SPICE Models Featuring Enhanced Simulation Speed |
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Willich-Münchheide, Germany, July 10, 2025 – ROHM has announced the release of new Level 3 (L3) SPICE models that deliver significantly improved convergence and faster simulation performance. |
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