| Press Releases 49 to 54 of 251 |
 |
| 10.06.2024 14:00 |
ROHM's new EcoSiC™ brand combines Performance and Sustainability |
|
Willich-Münchheide, Germany, June 10, 2024 – ROHM has announced the launch of its new EcoSiC brand. EcoSiC is a trademark for ROHM products using the advanced material silicon carbide (SiC). SiC is seen as a key material for the next generation of power semiconductors. It offers significant advantages in efficiency and reliability, particularly in high-performance applications such as electric vehicles, industrial equipment and renewable energy systems. With the introduction of EcoSiC, ROHM is positioning itself as a provider of advanced and sustainable technologies. |
|
|
| 06.06.2024 14:00 |
ROHM’s New Shunt Resistors Contribute to Greater Miniaturization in Automotive, Consumer, and Industrial Equipment Applications |
|
Willich-Münchheide, Germany, June 06, 2024 – ROHM has added three new products featuring a rated power of 5W in resistance values of 0.5, 1.0, 1.5 Milliohm to the 2512-size (0.25inch × 0.12inch) / 6432-size (6.4mm × 3.2mm) PMR100 series of standard type metal plate shunt resistors designed for motor control and power circuits in automotive, consumer, and industrial equipment applications. |
|
|
| 22.05.2024 14:00 |
ROHM and Nanjing SemiDrive Technology jointly Develop a Reference Design: Utilizing PMICs and SerDes ICs for SoC |
|
Willich-Münchheide, Germany, May 22, 2024 – ROHM and Nanjing SemiDrive Technology Ltd., China’s largest SoC manufacturer for smart cockpits, have jointly developed a smart cockpit reference design. The design is primarily based on SemiDrive’s X9M and X9E automotive SoCs, and includes PMICs, SerDes ICs, LED driver IC, and other components from ROHM. A reference board based on this design is also available, consisting of three boards: the CoreBoard, the SerDes Board, and the Display Board. |
|
|
| 15.05.2024 10:00 |
ROHM at PCIM Europe 2024: Empowering Growth, Inspiring Innovation |
|
Willich/Nuremberg, Germany, May 15, 2024 – During this year’s PCIM Europe – the leading trade fair for power electronics in Nuremberg, Germany (June 11th – 13th) – ROHM presents its new power semiconductor solutions – with a special focus on wide bandgap devices. |
|
|
| 23.04.2024 14:00 |
ROHM’s New Energy-Saving DC-DC Converter ICs Offered in the TSOT23 Package |
|
Willich-Münchheide, Germany, April 23, 2024 – ROHM has developed four new compact DC-DC step-down converter ICs suitable for consumer and industrial applications, including refrigerators, washing machines, PLCs, and inverters. ROHM is expanding the lineup which includes the BD9E203FP4-Z, a 2A buck converter with switching frequency of 350kHz. |
|
|
| 22.04.2024 09:05 |
ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement |
|
Kyoto (Japan) and Geneva (Switzerland), April 22, 2024 – ROHM (TSE: 6963) and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced today the expansion of the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, a ROHM group company. The new multi-year agreement governs the supply of larger volumes of SiC substrate wafers manufactured in Nuremberg, Germany, for a minimum expected value of $230 million. |
|
|
| |
««
«
7
8
9
10
11
»
»»
|
|
|
|
|
|
