| 19.01.2010 14:00 |
Infineon Introduces Innovative Power Switching Devices for Energy Efficient Home Appliances; 600V IGBT RC-Drives Family Addresses Variable Speed Motor System Design |
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Neubiberg, Germany – January 19, 2010 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced a family of power switching devices for use in high energy efficiency electric motor drives of home appliances. The new 600V IGBT RC-Drives family (RC for Reverse-Conducting) enables more cost-effective... |
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| 13.01.2010 13:00 |
Infineon Extends Power Conversion MOSFET Portfolio; New 200V and 250V OptiMOS™ Bring Industry Performance Leader Products in Their Voltage Class |
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Neubiberg, Germany – January 13, 2010 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today expanded the application scope of its OptiMOS™ power MOSFET portfolio, introducing a family of 200V and 250V devices well-suited for synchronous rectification in 48V systems, DC-DC converters, uninterruptable... |
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| 28.12.2009 10:15 |
Infineon Reaches Agreement to Settle Legal Dispute with Fairchild |
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Neubiberg, Germany - December 28, 2009 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced it has settled a patent infringement lawsuit with Fairchild Semiconductor. Infineon initiated the lawsuit in November 2008 in the U.S. District Court for the District of Delaware. ... |
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| 22.12.2009 12:42 |
Infineon Technologies AG raises guidance for first quarter financials |
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Neubiberg, Germany - December 22, 2009 - Infineon Technologies AG today raised the guidance for the first quarter of the 2009/10 fiscal year. For the first quarter of the 2009/10 fiscal year Infineon now expects high single digit growth in group revenues compared to the fourth quarter of the ... |
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| 16.12.2009 10:00 |
Collaborative Verification Along the Entire Value-Added Chain; “SANITAS” Research Project Launched Under Management of Infineon |
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Neubiberg, Germany - December 16, 2009 - A research project to strengthen German competiveness by developing processes and verification methods for more flexible and secure automated manufacturing has been launched by leading German companies. ... |
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| 09.12.2009 10:00 |
German Research Project "CoSiP" Lays Foundation for Simultaneous Development of Chip, Package and PCB Board for System-in-Package Applications |
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Neubiberg, Germany - December 9, 2009 - The growing complexity of microelectronic systems makes it necessary to align and coordinate the development of chips, packages and boards at a very early stage, especially when it comes to system-in-package (SiP) applications. In order to carry out research ... |
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