| 06.03.2013 10:00 |
Bundesdruckerei and Infineon Develop a Security Card with a One-Time Password and LED Display |
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Berlin / Neubiberg / Hanover, Germany - March 6, 2013 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Bundesdruckerei GmbH have developed a new security smart card with an LED display and a one-time password. This new technology is centred around a security chip in the card which generates a one-time password for each transaction and displays this on the integrated LED display. ... |
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| 28.02.2013 17:30 |
Supervisory Board extends contract of Dominik Asam |
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Neubiberg, Germany - February 28, 2013 - The Supervisory Board of Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has extended the contract of Chief Financial Officer Dominik Asam for five years until December 31, 2018. Dominik Asam was appointed as Chief Financial Officer to the Management Board... |
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| 28.02.2013 10:03 |
Annual General Meeting 2013 of Infineon Technologies AG in Munich/Germany |
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Infineon Annual General Meeting on February 28, 2013, 10.00 a.m. CET, ICM (Internationales Congress Center München), Munich/Germany ... |
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| 26.02.2013 09:30 |
Easy Switch from 8-bit to 32-bit with XMC1000 Industrial Microcontroller Family of Infineon; Samples and Tools Now Available |
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Neubiberg and Nuremberg, Germany - February 26, 2013 - At the Embedded World Exhibition & Conference 2013, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today presented samples of its new XMC1000 industrial 32-bit microcontroller family which provides system designers with strong incentive to switch from 8 to 32 bit MCU architecture. ... |
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| 19.02.2013 10:00 |
300-millimeter thin-wafer production by Infineon completes qualification; First CoolMOS™ family chips now being shipped worldwide |
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Neubiberg, Germany - February 19, 2013 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has achieved a major breakthrough in the manufacturing of power semiconductors on 300-millimeter thin wafers. In February, the company received the first customer go-aheads for products of the CoolMOS family produced by the 300-millimeter line at the Villach (Austria) site. ... |
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| 14.02.2013 15:00 |
New Type of Paste with Enhanced Thermal Conductivity for Modules – TIM Allows Higher Power Density for Same Ageing Resistance |
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Neubiberg/Germany and Irvine/USA - February 14, 2013 - Power electronics are experiencing a continuous rise in their power densities. As a consequence, thermal management for today’s power semiconductors must be integrated as early as their design phase. Only then can reliable cooling be safeguarded ... |
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