|New Infineon HybridPACK™ power modules enable fast and flexible electrification of vehicles|
|Munich, Germany – 2 May 2019 – In order to support the automotive industry in building up a broad and cost competitive portfolio of hybrid and electric vehicles (xEV), Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching new power modules for xEV main inverters. At this year’s PCIM trade fair Infineon will present four new HybridPACK™ Drive modules optimized for different inverter performance levels between 100 kW and 200 kW. Furthermore, Infineon introduces the HybridPACK Double Sided Cooling (DSC) S2, a technology upgrade to the existing HybridPACK DSC. This module targets main inverters up to 80 kW in hybrid and plug-in hybrid electric vehicles with high power density requirements.
HybridPACK Drive – same footprint, scalable performance
All new derivatives of the HybridPACK Drive have the same footprint as the already established lead device (FS820R08A6P2x) in the product family. This will allow system developers to scale inverter performance quickly and without a major system redesign.
At the lower-performance end of the product family, the new HybridPACK Drive Flat (FS660R08A6P2Fx) and Wave (FS770R08A6P2x) are cost-optimized for 100 kW up to 150 kW inverters respectively. Their baseplates – which connect to the cooler of the inverter – have different structures and thus lead to different capabilities of thermal dissipation. Instead of the established PinFin baseplate, which offers the highest cooling performance, the Flat version uses a flat baseplate without any structure at all. This leads to a lower power output at lower cost. The Wave version fills the performance gap between the Flat and PinFin derivatives with a Ribbon Bond baseplate structure.
At the upper end of the portfolio, the new HybridPACK Drive Performance (FS950R08A6P2B) targets 200 kW inverters. It is equipped with the same PinFin baseplate as the lead product. However, a dedicated ceramic material used instead of the known aluminum oxide improves cooling by more than 20 percent and thus enables higher current capabilities. Just like the Flat and Wave versions, the Performance product comes with the EDT2 (Electric Drive Train) IGBT generation known from the lead product. All derivatives with this chipset benefit from similar electric behavior.
The fourth new device (FS380R12A6T4x) is an alternative version of the Performance module, targeting 150 kW inverters. While it includes the same PinFin baseplate and performance ceramic, a different chipset of IGBT4 dies makes it the first derivative with a 1200 V blocking voltage. This will be necessary in electric vehicles with a battery voltage of more than 700 V for ultra-fast charging. For switching frequencies in the range of 8 kHz, the IGBT4 thus represents a less expensive alternative to SiC modules.
HybridPACK DSC S2 – performance increase of 40 percent
Infineon will now also equip the HybridPACK DSC module with EDT2 technology (HybridPACK DSC S2, FF450R08A03P2). The chipset with a 750 V blocking voltage shows benchmark current density, short circuit ruggedness and excellent light load power losses. The DSC S2 product uses the proven double-sided cooling package concept and in addition provides an extended short-term operating capability up to a chip junction temperature of 175°C.
The chip technology upgrade and the higher chip temperature operating capability lead to a 40 percent increase in the achievable performance from the same footprint compared to the existing HybridPACK™ DSC S1. In addition, this leads to a very high power density, which helps system developers to meet the tight space requirements in hybrid and plug-in hybrid vehicles.
As a compact half-bridge module, the HybridPACK DSC enables different inverter geometries and further motor integration. The on-chip current and temperature sensors contribute to an efficient and safe inverter operation.
The new HybridPACK Drive products will be available in June 2019, the HybridPACK DSC S2 will be available in July 2019. More information is available at www.infineon.com/hybridpack.
Infineon at the PCIM 2019
At the PCIM 2019 tradeshow, Infineon is presenting innovative product-to-system solutions for applications that are set to power the world and shape the future. Infineon’s demos are presented at booth #313 in hall 9 (Nuremberg, Germany, 7-9 May 2019). Information about the PCIM show highlights is available at www.infineon.com/pcim.
Infineon Technologies AG is a world leader in semiconductor solutions that make life easier, safer and greener. Microelectronics from Infineon is the key to a better future. In the 2018 fiscal year (ending 30 September), the Company reported sales of €7.6 billion with about 40.100 employees worldwide. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY).
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