LG and Infineon to introduce LG G8ThinQ with front-facing Time-of-Flight camera
With Infineon’s REAL3™ Image Sensor Chip, LG Offers Enhanced Security and Depth Measuring Selfie Camera
Munich, Germany, and Seoul, Korea, 7 February 2019 – LG Electronics and Infineon Technologies AG have teamed up to introduce leading edge Time-of-Flight (ToF) technology to smartphone selfie photo lovers world over.

Infineon’s REAL3™ image sensor chip will play a key role in the front-facing camera of the upcoming LG G8ThinQ, to be unveiled in Barcelona during Mobile World Congress 2019. Building upon the combined expertise of Infineon and pmdtechnologies in algorithms for processed 3D point clouds (a set of data points in space produced by 3D scanning), the innovative sensor will deliver a new level of front camera capability in a smartphone.

While other 3D technologies utilize complex algorithms to calculate an object’s distance from the camera lens, the ToF image sensor chip delivers more accurate measurements by capturing infrared light as it is reflected off the subject. As a result, ToF is faster and more effective in ambient light, reducing the workload on the application processor thereby also reducing power consumption.

And due to its fast response speed, ToF technology is widely used in various biometric authentication methods, such as face-recognition. What’s more, because ToF sees objects in 3D and is not affected by light from external sources, it delivers an excellent recognition rate, both indoors and out, ideal for implementation in augmented reality (AR) and virtual reality (VR) applications.

The world’s leading manufacturer of power semiconductors, Infineon is also recognized for its technological excellence in sensor solutions. The German chip maker enables highly reliable automotive, power management and digital security applications. The company developed the ToF technology featured in the LG G8ThinQ for use in both premium, high-end smartphones as well as mid-end devices.

“Infineon is poised to revolutionize the market,” said Andreas Urschitz, division president of Infineon’s Power Management & Multimarket division. “We have demonstrated service beyond the mere product level – specifically catering to phone OEMs, associated reference design houses and camera module manufacturers. Within five years, we expect 3D cameras to be found in most smartphones and Infineon will contribute a significant share.”

“Keeping in mind LG’s goal to provide real value to its mobile customers, our newest flagship was designed with ToF technology from inception to give users a unique and secure verification system without sacrificing camera capabilities,” said Chang Ma, senior vice president and head of Product Strategy at LG Mobile Communications Company. “The LG G8ThinQ featuring ToF will be the optimal choice for users in search of a premium smartphone that offers unmatched camera capabilities.”

Further information about REAL3™ is available at www.infineon.com/real3

About LG Electronics Mobile Communications Company

The LG Electronics Mobile Communications Company is a global leader and trend setter in the mobile and wearable industry with breakthrough technologies and innovative designs. By continually developing highly competitive core technologies in the areas of display, camera optics, audio and battery. LG creates handsets and wearables that fit the lifestyles of a wide range of consumers all over the world. LG is seeking to provide a mobile experience that extends beyond the scope of traditional smartphones. For more information, visit www.LG.com.

Media Contacts for LG Electronics, Inc.:
Ken Hong
+82 2 3777 3626
ken.hong@lge.com
www.LGnewsroom.com
About Infineon

Infineon Technologies AG is a world leader in semiconductor solutions that make life easier, safer and greener. Microelectronics from Infineon is the key to a better future. In the 2017 fiscal year (ending September 30), the company reported sales of about 7.1 billion euros with some 37,500 employees worldwide. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY).

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» Infineon Technologies
» Press Releases
» Press Release
Date: 07.02.2019 09:15
Number: INFXX201902-034e
» Press Photos

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The high degree of integration in Infineon’s REAL3™ image sensor enables a single-chip camera with reduced bill of materials and very small dimensions.

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Infineon’s 3D image sensor chip of the REAL3™ family is based on the Time-of-Flight (ToF) technology. It enables the world’s smallest camera module for integration in smartphones with a footprint of less than 12 mm x 8 mm.
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