Mobile World Congress: Infineon announces eSIM solution for mobile consumer devices
Munich, Germany – 25 February 2019 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) presents its new embedded SIM (eSIM) solution designed specifically for mobile consumer devices at Mobile World Congress (Barcelona, Spain, 25-28 February, Hall 6, stand 6C41). Infineon offers manufacturers of mobile handsets, tablets and laptops a tested and certified end-to-end solution comprising a chip, operating software and services. To further facilitate technical integration of the eSIM into consumer devices and accelerate time to market, Infineon can also provide data plans in cooperation with mobile network operators.

According to the ABI Research report, “eSIM and the Consumer Market” (QTR 3 2018), the eSIM smartphone market is set to reach 440 million units annually by 2023. Leading device manufacturers decided to incorporate this technology into their latest smartphones.

Embedded SIMs are on the rise as they provide better design options for device manufacturers  and meet increasing consumer demand for more flexibility. They allow, for instance, users to switch mobile network providers on the go and to access a multitude of customer-centric services from different carriers. Furthermore, looking at the security performance, SIM-based cellular connectivity is generally more resistant against security breaches than typical wireless network connections as it provides end-to-end encryption and secured key exchange.

Infineon’s eSIM solution offers substantial advantages for device manufacturers:
  • Increased design flexibility due to the eSIM’s small footprint of just 7.4mm² and simplified manufacturing processes
  • Elimination of the need for a separate SIM slot
  • Simplified logistics and global distribution thanks to a single stock keeping unit
  • Enablement of new innovative business models.
It will be available in sample quantities from mid-2019 onwards.
About Infineon

Infineon Technologies AG is a world leader in semiconductor solutions that make life easier, safer and greener. Microelectronics from Infineon is the key to a better future. In the 2018 fiscal year (ending 30 September), the Company reported sales of €7.6 billion with about 40.100 employees worldwide. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY).

Follow us: TwitterFacebook - LinkedIn
 
 
 
» Infineon Technologies
» Press Releases
» Press Release
Date: 25.02.2019 12:00
Number: INFDSS201902-040e
» Press Photos

 Download der hochauflösenden Version...
Embedded SIMs are on the rise as they provide better design options for device manufacturers  and meet increasing consumer demand for more flexibility.

 Download der hochauflösenden Version...
Infineon new eSIM solution is designed specifically for mobile consumer devices. Manufacturers of mobile handsets, tablets and laptops benefit from a tested and certified end-to-end solution comprising a chip, operating software and services.
» Contacts
Infineon Technologies AG

Media Relations
Tel: +49 89-234-28480
Fax: +49 89-234-9554521
media.relations@infineon.com

Investor Relations:
Tel: +49 89 234-26655
Fax: +49 89 234-9552987
investor.relations@infineon.com
» More Press Releases
29.05.2026 10:45
Infineon sets new benchmark for electric vehicle inverters and introduces first silicon carbide power module operating at 205°C

29.05.2026 03:15
Infineon Joins NVIDIA’s MGX™ AI Factory Ecosystem to Transform Power Delivery Architecture for Next-Generation AI Server Racks

28.05.2026 10:15
Infineon’s SECORA™ Connect X and SECORA™ Wallet brings secured contactless payment to smart wearables

26.05.2026 10:15
Infineon presents semiconductor solutions for power infrastructure, AI data centers, robotics and electromobility at PCIM Europe 2026

20.05.2026 12:45
Infineon CoolGaN™ BDS 40 V G3 family delivers up to 82 percent footprint reduction for portable power designs