Infineon extends its portfolio of CoolSiC™ MOSFET power modules for UPS and energy storage applications
Munich, Germany – 31 January 2019 – Addressing the fast growing demand for Silicon Carbide (SiC) solutions, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches new devices in the 1200V CoolSiC™ MOSFET family. The CoolSiC Easy 2B power modules enable engineers to reduce system costs by increasing power density. In addition, they can also lower operational costs significantly. Owing to about 80 % lower switching losses compared to silicon IGBTs, inverter efficiency levels exceeding 99 % can be reached. Because of the specific SiC properties, the same or even higher switching-frequency operation can be realized. This is particularly attractive for fast switching applications such as UPS and energy storage.

The Easy 2B standard package for power modules is characterized by an industry-leading low stray inductance. With a variety of half-bridge, six-pack and booster modules, Infineon offers the largest SiC portfolio in the Easy package on the market. The half-bridge configuration of the CoolSiC Easy 2B can easily be used for building up four- and six-pack-topologies. The new device widens the power range of modules in half-bridge topology with an on-resistance (RDS(on)) per switch to only 6 mΩ. This is a benchmark performance for devices in Easy 2B housing.

Additionally, the integrated body diode of the CoolSiC MOSFET chip ensures a low-loss freewheeling function without the need for another diode chip. While the NTC temperature sensor facilitates the monitoring of the device, the PressFIT technology reduces assembly time for mounting the device.

Availability

The CoolSiC MOSFET Easy 2B modules are available now. Just recently, Infineon launched the first CoolSiC™ MOSFET six-pack module in the well-established Easy 1B package with an RDS(on) of 45 mΩ. More information is available at www.infineon.com/coolsic-mosfet.
About Infineon

Infineon Technologies AG is a world leader in semiconductor solutions that make life easier, safer and greener. Microelectronics from Infineon is the key to a better future. In the 2018 fiscal year (ending 30 September), the Company reported sales of €7.6 billion with about 40.100 employees worldwide. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY).

Follow us: TwitterFacebook - LinkedIn
 
 
 
» Infineon Technologies
» Press Releases
» Press Release
Date: 31.01.2019 10:15
Number: INFIPC201901-032e
» Press Photos

 Download der hochauflösenden Version...

 Download der hochauflösenden Version...
The new CoolSiC Easy 2B widens the power range of modules in half-bridge topology with an on-resistance (RDS(ON)) per switch to only 6 mΩ. This is a benchmark performance for devices in Easy 2B housing.
» Contacts
Infineon Technologies AG

Media Relations
Tel: +49 89-234-28480
Fax: +49 89-234-9554521
media.relations@infineon.com

Investor Relations:
Tel: +49 89 234-26655
Fax: +49 89 234-9552987
investor.relations@infineon.com
» More Press Releases
15.05.2025 15:50
Infineon gains approval of Science Based Targets initiative for ambitious CO2 emission reduction targets

13.05.2025 10:15
PSOC™ 4100T Plus microcontroller offers advanced sensing capabilities and system control in a single chip

12.05.2025 11:15
Infineon introduces CoolGaN™ Bidirectional Switch 650 V G5 for enhanced efficiency and reliability in power systems

09.05.2025 10:15
Infineon and Visteon Collaborate on Advanced Power Conversion Systems for Next-Generation Electric Vehicles

08.05.2025 14:15
Infineon SEMPER™ NOR Flash memory family achieves ASIL-D functional safety certification