Activities of the Board and Supervisory Board Approved at Infineon AGM –Shareholders Receive a Dividend Payment of Euro 0.12 per Share
Neubiberg and Munich, Germany – February 13, 2014 – Around 3,100 sharehold-ers attended the 14th ordinary Annual General Meeting of Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) at the International Congress Center in Munich today. A total of 48.54 percent of the Infineon share capital was represented and decided on seven agenda items. The vast majority of the shareholders approved the business activities of the Board and Supervisory Board as well as the distribution of a dividend of Euro 0.12 per dividend-entitled share. The other proposals of the managements were also approved by a large majority.

Detailed information about the 2014 Annual General Meeting of Infineon Technol-ogies AG is available here. The results of the votes on the individual agenda items will be published at around 4.00 p.m. on this web page.
About Infineon

InfineonTechnologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, mobility, and security. In the 2013 fiscal year (ending September 30), the company reported sales of Euro 3.84 billion with close to 26,700 employees worldwide. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY).

Further information is available at www.infineon.com
 
 
 
» Infineon Technologies
» Press Releases
» Press Release
Date: 13.02.2014 15:00
Number: INFXX201402.021
» Contacts
Infineon Technologies AG

Media Relations
Tel: +49-89-234-28480
Fax: +49-89-234-9554521
media.relations@infineon.com

Investor Relations:
Tel: +49 89 234-26655
Fax: +49 89 234-9552987
investor.relations@infineon.com
» More Press Releases
05.11.2025 13:30
Infineon and SolarEdge collaborate to advance high-efficiency power infrastructure for AI data centers

31.10.2025 10:30
Infineon’s new MOTIX™ system-on-chip family for motor control enables compact and cost-efficient designs

30.10.2025 10:15
New UWB application lab strengthens Infineon’s leadership in trusted connectivity system solutions

29.10.2025 11:00
Silicon carbide power modules in new EasyPACK™ C package enhance efficiency and lifetime of industrial applications

27.10.2025 10:15
Infineon adds SPICE-based model generation to IPOSIM platform for more accurate system-level simulation