Infineon First Quarter FY 2012 sales and earnings slightly ahead of guidance
  • Quarterly sales of Euro 946 million down from Euro 1.038 billion
  • Superior growth and profitability: 14 percent growth in calendar year 2011 vs 3 percent for industry excluding memories and microprocessors
  • 14.9 percent Total Segment Result Margin in-line with through-cycle target
  • Sustained efforts for future success: counter-cyclical investments of Euro 294 million to enable move to highly competitive 300mm manufacturing; sustaining high R&D and selling expense
  • Strong returns: 27 percent RoCE for the quarter; 1.0 percent reduction in fully diluted share count
  • Outlook for the second quarter of the FY 2012: sales to be flat to down slightly; Total Segment Result Margin to be down broadly by 1 percentage point
Full version of news release (incl. financial data)
About Infineon

Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, mobility, and security. In the 2011 fiscal year (ending September 30), the company reported sales of Euro 4.0 billion with close to 26,000 employees worldwide. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY). Further information is available at www.infineon.com.
 
 
 
» Infineon Technologies
» Press Releases
» Press Release
Date: 01.02.2012 07:31
Number: INFXX201202.021
» Downloads
Full version of news release (incl. financial data) (INFXX201202-021e.pdf)
» Contacts
Infineon Technologies AG

Media Relations
Tel: +49-89-234-28480
Fax: +49-89-234-9554521
media.relations@infineon.com

Investor Relations:
Tel: +49 89 234-26655
Fax: +49 89 234-9552987
investor.relations@infineon.com
» More Press Releases
31.10.2025 10:30
Infineon’s new MOTIX™ system-on-chip family for motor control enables compact and cost-efficient designs

30.10.2025 10:15
New UWB application lab strengthens Infineon’s leadership in trusted connectivity system solutions

29.10.2025 11:00
Silicon carbide power modules in new EasyPACK™ C package enhance efficiency and lifetime of industrial applications

27.10.2025 10:15
Infineon adds SPICE-based model generation to IPOSIM platform for more accurate system-level simulation

22.10.2025 11:00
AURIX™ Configuration Studio: new tool framework accelerates software development for AURIX devices