Press Releases 31 to 36 of 1570
28.02.2024 11:15 Infineon introduces new Solid-State Isolators to deliver faster switching with up to 70 percent lower power dissipation
Munich, Germany, and Long Beach, California - 28 February 2024 – Today at the Applied Power Electronics Conference (APEC), Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduced a new product family of Solid-State Isolators to achieve faster and more reliable circuit switching with protection features not available in optical-based solid state relays (SSR). The isolators use coreless transformer technology and support 20 times greater energy transfer with both current and temperature protection contributing to a higher reliability and lower cost of ownership. The new solid-state isolators allow driving the gates of Infineon’s MOS-controlled power transistors OptiMOS ™ and CoolMOS™ to reduce power dissipation of up to 70 percent of todays’ solid-state relays using SCR (silicon-controlled rectifier) and Triac switches.
28.02.2024 09:30 Infineon reorganizes sales and marketing to boost customer centricity and lead in application support
Munich, Germany – 28 February 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is setting the course for ambitious growth by further strengthening and streamlining its sales organization. Starting 1 March, Infineon’s sales team will be structured around three customer-centric Sales Segments: “Automotive”, “Industrial & Infrastructure” and “Consumer, Computing & Communication”. The DEM sales organization will retain responsibility for distributors and Electronics Manufacturing Services (EMS). This new structure will further leverage the potential of Infineon’s comprehensive and diverse product portfolio by putting customers’ application needs at the center of the new organizational model. All of these organizations will be deployed globally with an optimized regional footprint.
27.02.2024 14:15 Infineon advances automotive and industrial solutions with newly launched CoolSiC™ MOSFET 750 V G1 product family
Munich, Germany – 27 February 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the 750V G1 discrete CoolSiC™ MOSFET to meet the increasing demand for higher efficiency and power density in industrial and automotive power applications. The product family includes both industrial-graded and automotive-graded SiC MOSFETs that are optimized for totem-pole PFC, T-type, LLC/CLLC, dual active bridge (DAB), HERIC, buck/boost, and phase-shifted full bridge (PSFB) topologies. The MOSFETs are ideal for use in both typical industrial applications, such as electric vehicle charging, industrial drives, solar and energy storage systems, solid state circuit breaker, UPS systems, servers/datacenters, telecom, and in the automotive sector, such as onboard chargers (OBC), DC-DC converters, and many more.
26.02.2024 16:00 Infineon unveils high density power modules to enable benchmark performance and TCO for AI data centers
Munich, Germany, Long Beach, California – 26 February 2024 – Artificial Intelligence is currently driving an exponential increase in global data generation, and consequently increasing the energy demands of the chips supporting this data growth. Today, Infineon Technologies AG launched its TDM2254xD series dual-phase power modules that enable best-in-class power density, quality and total cost of ownership (TCO) for AI data centers. The TDM2254xD series products blend innovation in robust OptiMOSTM MOSFET technology with novel packaging and proprietary magnetic structure to deliver industry-leading electrical and thermal performance with robust mechanical design. This lets data centers operate at higher efficiency to meet the high power demands of AI GPU (Graphic Processor Unit) platforms while also significantly reducing TCO.
26.02.2024 08:45 Infineon to start limited Share Buyback Program serving fulfillment of obligations under existing employee participation programs
Munich, Germany – 26 February 2024 – On 15 September 2023, the Management Board of Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) resolved, with the approval of the Supervisory Board, to acquire up to 7,000,000 shares (ISIN DE0006231004) via the stock exchange at a total purchase price (excluding incidental costs) of up to €300 million.
23.02.2024 15:50 Infineon Annual General Meeting approves dividend of €0.35 per share – Changes to the Supervisory Board: Ute Wolf and Prof. Dr. Hermann Eul elected to the Supervisory Board
Munich, Germany – 23 February 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has finished its 24th Annual General Meeting. The entire event was held in a virtual format and broadcast publicly on the company web site. Shareholders had the opportunity to speak live during the event and ask questions.
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