| 13.02.2006 08:00 |
Infineon Technologies 3G Platform Selected by Vodafone |
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Munich, Germany - February 13, 2006 - Infineon Technologies AG, a leading supplier of communications products, announced today that Vodafone, the world’s largest mobile community, will evaluate the company’s UMTS dual mode platform. The first 3G mobile phones based on Infineon’s MP-EU UMTS multimedia... |
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| 13.02.2006 08:00 |
Infineon Brings HSDPA High-Speed Data Access with Data Rates of up to 7.2 Mbit/s to Mass Market Mobile Phones, Offers Complete Scalable Multimedia Phone Solution |
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Munich, Germany / Barcelona, Spain - February 13, 2006 - Infineon Technologies AG (FSE/NYSE: IFX) today, at the 3GSM World Congress in Barcelona, announced sample availability of its latest baseband processor supporting HSDPA (High-Speed Downlink Packet Access) data rates of up to 7.2 megabits per ... |
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| 13.02.2006 08:00 |
New Infineon Mobile Phone Chip Sets New Industry Standard for Ultra Low-Cost Handsets, Shrinks Electronic Component Count to Fewer Than 50 and Cuts Manufacturer Cost to US |
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Munich, Germany and Barcelona, Spain – February 13, 2006 – The latest chip from Infineon Technologies AG (FSE/NYSE: IFX) reduces the number of electronic components in a basic mobile phone from about 100 to fewer than 50. In addition to providing the user the basic ability to make telephone calls ... |
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| 10.02.2006 13:00 |
Infineon Announces Availability of Innovative Integrated Semiconductor Solutions to Drive Future Mobile Communications |
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Munich - February 10, 2006 - Infineon Technologies (FSE/NYSE: IFX), a leading supplier of advanced communication ICs and solutions, today announced sample availability of its latest baseband processor for multimedia mobile phones of the so-called 3.5 generation as well as its second generation platform... |
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| 09.02.2006 15:40 |
Infineon Presents Innovative Design and Circuit Concepts for Next Generations of Multimedia Communication Systems |
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Munich, February 9, 2006 - Infineon Technologies (FSE/NYSE: IFX), a leading supplier of advanced communication ICs and solutions, presented at the ISSCC 2006 (IEEE International Solid-State Circuits Conference) in San Francisco (February 4 - 8, 2006) several technical papers, in the context of 13 papers... |
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| 07.02.2006 11:00 |
Rainer Westermann to leave Infineon |
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Munich, Germany February 7, 2006 - Infineon Technologies announced today that Rainer Westermann, Corporate Vice President Communications, will be leaving the company. Westermann has been responsible for the entire corporate communications at Infineon including PR, Marketing Communications, Government... |
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