| 30.10.2024 10:00 |
Infineon introduces DEEPCRAFT™ brand for Edge AI software solutions and launches new Ready Models |
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Munich, Germany – 30 October 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is further strengthening its AI software portfolio as Edge AI comes to a growing number of consumer and industrial applications. With that in mind, the company introduces DEEPCRAFT™, a new software solution category brand for Edge AI and Machine Learning. Infineon recognizes the huge potential of Edge AI for the market, and the importance of providing customers with the tools to utilize Edge AI. |
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| 29.10.2024 10:00 |
Infineon unveils the world’s thinnest silicon power wafer, pushing technical boundaries and improving energy efficiency |
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Munich, Germany – 29 October 2024 – After announcing the world’s first 300-millimeter gallium nitride (GaN) power wafer and opening the world’s largest 200-millimeter silicon carbide (SiC) power fab in Kulim, Malaysia, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has unveiled the next milestone in semiconductor manufacturing technology. Infineon has reached a breakthrough in handling and processing the thinnest silicon power wafers ever manufactured, with a thickness of only 20 micrometers and a diameter of 300 millimeters, in a high-scale semiconductor fab. The ultra-thin silicon wafers are only a quarter as thick as a human hair and half as thick as current state-of-the-art wafers of 40-60 micrometers. |
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| 28.10.2024 10:00 |
Infineon at electronica 2024: Solutions for decarbonization and digitalization |
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Munich, Germany – 28 October 2024 – At the upcoming electronica trade show in Munich, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will illustrate how its innovative solutions are driving the global trends of decarbonization and digitalization. The company will show how its semiconductors are paving the way to a net-zero economy and to unlocking the full potential of artificial intelligence (AI). From 12 to 15 November at booth 502 in hall C3, Infineon will present highlights from its extensive portfolio and offer the opportunity to talk to its experts. |
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| 23.10.2024 10:15 |
CoolSiC™ Schottky diode 2000 V enables higher efficiency and design simplification in DC link systems up to 1500 VDC |
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Munich, Germany – 23 October 2024 – Many industrial applications today are transitioning to higher power levels with minimized power losses, which can be achieved through increased DC link voltage. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) addresses this challenge by introducing the CoolSiC™ Schottky diode 2000 V G5, the first discrete silicon carbide diode on the market with a breakdown voltage of 2000 V. The product family is suitable for applications with DC link voltages up to 1500 VDC and offers current ratings from 10 to 80 A. This makes it ideal for higher DC link voltage applications such as in solar and EV charging applications. |
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| 16.10.2024 10:00 |
Infineon launches SECORA™ Pay Green – the world’s first contactless payment card technology allowing for up to 100% reduction in plastic waste |
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Munich, Germany – 16 October 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is paving the way to a significant reduction of plastic waste and CO2 emissions in the payment card industry. The company today announced the launch of SECORA™ Pay Green which enables card designs allowing production of the world’s first fully recyclable contactless (dual-interface) payment card bodies based on environmentally friendly and locally sourced materials. |
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| 15.10.2024 11:13 |
HybridPACK™ Drive G2 Fusion: Infineon combines silicon and silicon carbide in a cutting-edge power module for e-mobility |
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Munich, Germany – 15 October 2024 – Affordability combined with high performance and efficiency is the key to making electric mobility accessible to a broader market. That's why Infineon Technologies AG is introducing the HybridPACK™ Drive G2 Fusion, establishing a new power module standard for traction inverters in the e-mobility sector. The HybridPACK Drive G2 Fusion is the first plug'n'play power module that implements a combination of Infineon’s silicon and silicon carbide (SiC) technologies. This cutting-edge solution provides an ideal balance between performance and cost efficiency, giving more choice in the optimization of inverters. |
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