ROHM’s New MOSFETs: Contributing to Higher Efficiency and Safer Operation with an Original Insulation Structure

Deliver class-leading power dissipation in a compact package  ideal for small, thin devices

Willich-Münchheide, Germany, December 19, 2022 – ROHM has recently developed a compact, high efficiency 20V Nch MOSFET, RA1C030LD, optimized for switching in small, thin devices, including smartphones and wearables such as wireless earbuds and other hearable equipment. (Fig. 1) In recent years, the increasing sophistication and power requirements of compact devices have resulted in larger batteries that reduce the space available for mounting components. At the same time, there is a limit to the size of the battery, so to ensure more efficient use of battery power the power loss of mounted components must be minimized. To meet this need, the development of MOSFETs in wafer-level chip-size packages (WLCSP) that contribute to greater miniaturization while maintaining the necessary characteristics is becoming mainstream in the industry. ROHM leverages its strengths as an IC manufacturer to significantly reduce wiring resistance (which has increased with conventional discrete processes). The result is a compact power MOSFET that delivers low power loss. The RA1C030LD is offered in the DSN1006-3 wafer-level, chip-size package (1.0mm × 0.6mm) that takes advantage of ROHM’s proprietary IC process to achieve low power dissipation together with greater miniaturization. In terms of the figure of merit that expresses the relationship between conduction and switching losses (ON-resistance × Qgd), an industry-leading value has been achieved that is 20% lower than standard package products in the same package (1.0mm × 0.6mm or smaller), contributing to a significantly smaller board area along with higher efficiency in a variety of compact devices. At the same time, ROHM’s unique package structure provides insulated protection for the side walls (unlike standard products in the same package with no protection). This reduces the risk of shorts due to contact between components in compact devices that must resort to high density mounting due to space constraints, contributing to safer operation. Going forward, ROHM will continue to develop products with even lower ON resistance in smaller package sizes that contribute to solving social issues such as environmental protection by improving efficiency in a variety of compact devices. (Fig. 2 + 3) Specifications (Fig. 4) Application Examples Hearables (i.e. wireless earbuds) Wearables such as smart watches, smart glasses, and action cameras Smartphones Also suitable for switching in a wide range of thin, compact devices. Online Sales Information Sales Launch Date: December 2022 Online Distributors: Digi-Key, Mouser, and Farnell Scheduled for release at other online distributors as well. *ROHM December 19, 2022 study

About ROHM Semiconductor ROHM Semiconductor is a global company of 452.1 billion Yen (3.3 billion Euros) per March 31st, 2022, with over 23,000 employees. The company develops and manufactures a very large product range from SiC Diodes and MOSFETs, Analog ICs such as Gate Drivers and Power Management ICs to Power Transistors and Diodes to Passive Components. The production of our high performing products is taking place in state-of-the-art manufacturing plants in Japan, Germany, Korea, Malaysia, Thailand, the Philippines, and China. ROHM Semiconductor Europe has its Head Office near Dusseldorf serving the EMEA region (Europe, Middle East and Africa). For further information, please contact www.rohm.com