Press Releases 31 to 32 of 32
03.05.2016 10:00 PCIM 2016: AT&S ECP® Technology Enables GaN Systems Inc. to Develop Extremely Small and Reliable High-Voltage GaN Power Switching Transistors
03 May 2016 - Embedded Component Technology (ECP) is AT&Ss solution to the next generation miniaturization demands of high performance applications and products. Embedding components within an electronic module offers significant advantages such as further miniaturization through stacking of electronic components ...
02.05.2016 08:40 UTAC and AT&S Collaborate on Turnkey Supply for 3D SiP Solutions with Embedded Chip in Substrate Technology
Singapore / Austria, 02 May 2016 UTAC Holdings Ltd (UTAC), one of the leading semiconductor assembly and test services provider in Asia, announced today a joint collaboration with AT&S, one of the global leading manufacturers of high-end printed circuit boards (PCBs) with headquarters in Leoben, ...
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