Press Releases 19 to 24 of 25
06.02.2017 12:00 World’s smallest speaker uses PCB technology and system integration expertise from AT&S
Leoben and Graz, 06 February 2017 – Graz-based start-up USound, in partnership with several Fraunhofer Institutes (IDMT, ISIT, IIS and IZM) and utilizing PCB technology together with system integration expertise from AT&S, has developed what is not only the world’s smallest speaker, but also the ...
16.12.2016 10:00 AT&S develops innovative products facing the rising challenges of advancing miniaturisation, higher data rates/frequencies and higher power density
Leoben and Tokyo, December 16, 2016 – At Nepcon 2017 (18-20 January 2017) in Tokyo, AT&S will be presenting innovative technologies as a response to current challenges in telecommunication, automotive electronics, wearables and medical electronics. Advancing miniaturisation, high data rates and/or ...
23.09.2016 10:00 AT&S offers comprehensive solutions for miniaturisation on all interconnection layers thanks to new toolbox
September 23, 2016 - Constantly increasing system requirements call for ever more efficient solutions with higher power densities and high-speed designs whilst preserving signal integrity. Key growth drivers accompany the digital revolution with increasing networking and growing data volumes and ...
31.08.2016 12:00 AT&S Tech Days in Santa Clara - Update of the Latest Trends in PCB Technologies
August 31, 2016 – AT&S Americas, LLC is organizing the AT&S Tech Days on September 12-13 in Santa Clara, California. During the first day technical seminars and presentations from AT&S and partners will highlight the latest innovations  and market trends for PCB technology. The event will take place...
14.06.2016 15:00 UTAC, Sarda and AT&S Collaborate in Delivering Small, Fast Voltage Regulators to Improve Data Center Energy Efficiency
June 14, 2016 –  Sarda Technologies (Sarda), a disruptive power management component supplier and UTAC Holdings Ltd (UTAC), one of the leading semiconductor assembly and test services providers in Asia, today announced that Sarda will implement its Heterogeneous Integrated Power Stage (HIPS) in UTAC...
03.05.2016 10:00 PCIM 2016: AT&S ECP® Technology Enables GaN Systems Inc. to Develop Extremely Small and Reliable High-Voltage GaN Power Switching Transistors
03 May 2016 - Embedded Component Technology (ECP) is AT&S’s solution to the next generation miniaturization demands of high performance applications and products. Embedding components within an electronic module offers significant advantages such as further miniaturization through stacking of electronic components ...
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