Press Releases 13 to 18 of 25
29.11.2017 11:00 Optimized and cost-efficient design implementation using AT&S X-in-Board technology
Leoben, November 29, 2017 In addition to its comprehensive portfolio of standard printed circuit board (PCB) technologies, AT&S also has various special processes, materials and technologies that are optimized for specific requirements like high-density wiring, enhanced thermal performance or high...
12.10.2017 12:15 From hearing aids and pacemakers to prostheses: Highly miniaturized and extremely reliable thanks to innovative PCB technology from AT&S
Leoben, 12 October 2017 The trend for miniaturization and digitalization is shaping medical technology, too. Systems and components for treatment, diagnosis and patient monitoring are becoming ever smaller and more powerful. In medical technology, more than any other field, safety and reliability ...
30.08.2017 10:00 AT&S Enables "Cool" Designs for Miniaturized High-Power Applications
Leoben, August 30, 2017 Miniaturization and increasing power densities are major concerns for modern electronic applications. The lifetime of electronic applications can be dramatically reduced by the increase of the working temperatures by just a few degrees...
06.07.2017 16:00 AT&S paves the way for autonomous driving and high-speed communication
Leoben, 6 July 2017 The automotive industry is focusing its efforts on developing solutions for autonomous driving and car-to-car communication. At the same time, the communications industry is moving towards 5G, and broadband networks are becoming ever faster. Large and complex volumes of data ...
25.04.2017 10:00 ECP® technology from AT&S enables evaluation of a fully integrated multilevel power converter on GaN basis
Leoben, 25 April 2017 Fraunhofer IAF has developed a fully integrated monolithic multilevel converter in high-volt AlGaN/GaN-on-Si technology. The integrated inverter circuit is designed for maximum voltages of +/- 400 V and currents of 5 A. The multilevel converter on an area of just 2 × 3 mm² ...
01.03.2017 11:00 AT&S advances PCB, module and packaging technologies
Leoben, March 1st 2017 For years, AT&S has worked at the forefront of process and technology development to meet the challenges of continued miniaturization and the demand for better energy efficiency. In this context, the company is involved in various research and development programmes. One ...
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