Press Releases 1 to 6 of 38
28.10.2021 14:00 AT&S initiates the start of construction for the company’s first high-tech manufacturing in Southeast Asia
Kuala Lumpur/Leoben, 28 October 2021 – AT&S, one of the globally leading manufacturers of high-end printed circuit boards and IC substrates, headquartered in Austria (Europe), today announced detailed project information on the company’s planned investment in a state-of-the-art factory for IC substrates at the Kulim Hi-Tech Park, Kedah.
15.10.2021 12:30 AT&S continues to invest in its Leoben site
Leoben, 15 October 2021 – In view of the ongoing boom in demand in the microelectronics sector and ever-new performance requirements for electronic systems, AT&S has decided to put an even stronger focus on research and development. Therefore, the company is investing in a new R&D center for substrate and packaging solutions for the global semiconductor industry at its location in Leoben-Hinterberg. In addition, another technology upgrade of the production facilities will be implemented. The investments totaling € 500 million are planned up to 2025. The investment total includes previously communicated investments in a technology upgrade and the new AT&S office building.
17.09.2021 11:15 AT&S wins a Futurezone Award 2021 with “Air Cavities”
Leoben, September 17, 2021 – With the advancing digitalization, the demands on the digital infrastructure will increase massively in the coming years. In particular, the new 5G mobile communications standard will increase the data volume exponentially. "These rapidly growing amounts of data have to be processed, transmitted and stored with the least possible time delay and the smallest possible losses," explains Hannes Voraberger, Director R&D at the Styrian high-tech group AT&S. After all, the slightest delay - in the case of self-driving cars, for example - could already have fatal consequences. This is exactly where the award-winning innovation from AT&S comes in. "We have dealt intensively with new materials, manufacturing processes, and design features for innovative interconnection solutions and found a way to specifically place air chambers in the circuit board and reduce dielectric loss to an absolute minimum," says Voraberger.
12.07.2021 13:00 Close cooperation agreed – Dato' Seri Mohamed Azmin Ali visits AT&S in Leoben
Leoben, July 12, 2021 – Innovative strength, technology leadership, and solution orientation have made AT&S one of the world's largest and most successful suppliers of advanced interconnect technologies. With its current expansion step – a new plant for IC substrates – AT&S is expanding its geographical footprint and will be represented in Malaysia in the future. During a visit to AT&S's Group headquarters in Leoben Hinterberg, a delegation from the Malaysian Senior Minister of Economy and Industry, Dato' Seri Mohamed Azmin Ali, was able to see for themselves AT&S's innovative strength and to discuss further cooperation steps and future projects with the Management Board team.
05.07.2021 11:00 1 mm² in size and 1 gram in weight
Leoben, July 5, 2021 – The image sensor is smaller than a grain of rice, lighter than a postage stamp but more powerful than any previous development of its kind. With a size of 1 mm² and a weight of about 1 gram, the image sensor is so small that it can not only be installed in smartphones, VR cameras, and other wearables but can also be integrated into medical applications such as endoscopes...
21.04.2021 13:00 AT&S uses “smart” quality controls in PCB production
Leoben, 21. April 2021 – Printed circuit boards are the nervous system of all electronic devices. Whether for mobile devices or in the automotive, industrial and medical sectors. The areas of application are diverse, as is the production. Around 150 complex work steps are required for a single circuit board before it is ready for use.
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