Press Releases 1 to 6 of 16
25.10.2018 16:00 AT&S develops and manufactures miniaturised printed circuit boards for medical technology
Leoben, 25 October 2018 AT&S is addressing the trend towards miniaturisation and digitisation in medical technology as well. At the same time, the systems and components for therapy, diagnosis and patient monitoring are getting smaller, but more powerful. Despite progressive miniaturisation, ...
19.06.2018 14:00 AT&S offers interconnection technologies for next-generation 5G mobile communications
Leoben, 19 June 2018 Significantly higher data rates and volumes together with high power densities are resulting in rising requirements for interconnection technologies, too. The new 5G mobile communications generation is undoubtedly an overarching and defining trend here, with applications ...
02.05.2018 15:00 AT&S offers a look into the future of connection technology: From the printed circuit board to the all-in-one package
Presentations at the 14th AT&S Technology Forum highlighted current trends, challenges and solutions for printed circuit boards and comprehensive connection technologies. ...
29.11.2017 11:00 Optimized and cost-efficient design implementation using AT&S X-in-Board technology
Leoben, November 29, 2017 In addition to its comprehensive portfolio of standard printed circuit board (PCB) technologies, AT&S also has various special processes, materials and technologies that are optimized for specific requirements like high-density wiring, enhanced thermal performance or high...
12.10.2017 12:15 From hearing aids and pacemakers to prostheses: Highly miniaturized and extremely reliable thanks to innovative PCB technology from AT&S
Leoben, 12 October 2017 The trend for miniaturization and digitalization is shaping medical technology, too. Systems and components for treatment, diagnosis and patient monitoring are becoming ever smaller and more powerful. In medical technology, more than any other field, safety and reliability ...
30.08.2017 10:00 AT&S Enables "Cool" Designs for Miniaturized High-Power Applications
Leoben, August 30, 2017 Miniaturization and increasing power densities are major concerns for modern electronic applications. The lifetime of electronic applications can be dramatically reduced by the increase of the working temperatures by just a few degrees...
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