Press Releases 253 to 258 of 260
02.07.2012 16:00 Maxim´s Collection of Peripheral Modules Enables Rapid Prototyping with FPGAs and Significantly Lowers Costs
PLANEGG, Germany – July 2, 2012 – Maxim Integrated Products, Inc. (NASDAQ: MXIM) announces a collection of 15 peripheral modules which plug directly into any FPGA/CPU expansion port that follows the Digilent Pmod standard. Plug-in simplicity and easy software integration allow rapid prototyping ...
28.06.2012 10:00 Maxim Invests $200 Million in Expansion and Equipment Upgrades for Its U.S. Manufacturing Facilities
San Jose, California/USA – June 27, 2012 – Maxim Integrated Products, Inc. (NASDAQ: MXIM) today announced a 200 million dollar multiyear investment to upgrade its U.S. wafer fabrication facilities (fabs) in Beaverton, Oregon; Dallas and San Antonio, Texas; and San Jose, California. Maxim will use the...
26.06.2012 16:00 Maxim’s Essential Solutions Anticipate the Next-Generation Cellular Network
PLANEGG, Germany – June 26, 2012 – Maxim Integrated Products, Inc. (NASDAQ: MXIM) announces several essential HetNet solutions needed for next-generation base-station equipment. The solutions include single-chip multiband radio transceivers, broadband gain blocks, direct RF synthesis DACs, and ...
19.06.2012 16:35 Maxim Introduces Third-Generation TINI® Power SoC Chipset for Smaller, Thinner, and More Energy-Efficient Smartphones
PLANEGG, Germany – June 19, 2012 – Maxim Integrated Products, Inc. (NASDAQ: MXIM) announced that its newest Power SoC chipset in the Galaxy S III operates with the Exynos 4412 quad-core applications processor to provide a smaller, much thinner, and significantly more efficient smartphone.

Maxim’s ...
11.06.2012 15:40 Maxim’s RF-DAC Technology Delivers Software-Defined Radio Benefits to Macro- and Small Cell Base Stations
PLANEGG, Germany – June 11, 2012 – Maxim Integrated Products, Inc. (NASDAQ: MXIM) announces the MAX5879 multi-Nyquist RF digital-to-analog converter (RF DAC) that delivers a fully digital software-defined radio (SDR) transmitter,  enabling a common hardware platform for multicarrier, multiband, and ...
29.05.2012 15:00 Maxim’s High-Density QAM Modulator Chipset Enables the Next-Generation Connected Home Experience
PLANEGG, Germany – May 29, 2012 – Maxim Integrated Products, Inc. (NASDAQ: MXIM) announces a new high-density, wideband, scalable QAM modulator chipset: the MAX5880 digital upconverter (DUC) and MAX5882 RF ...
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