New modules in 62 mm package enable higher power density
Munich, Germany – March 10, 2017 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its offering of 62 mm IGBT modules. The new power modules serve the growing demand for higher power density without increasing package size. This is realized by a larger chip area and an adapted DCB substrate in the proven 62 mm package. Typical applications for modules with 1200 V blocking voltage are drives, solar inverters and uninterruptible power supply (UPS) as well as medium voltage drives for modules with 1700 V blocking voltage.

With a blocking voltage of 1200 V, the 62 mm module reaches a maximum current rating of 600 A. At 1700 V blocking voltage, the maximum current rating is 500 A, making Infineon the market leader for this rating. The package is equipped with a base plate, its size corresponds to the industrial standard. It can therefore easily be integrated into existing designs delivering, for example, 20 percent more output power when applied for drives. The portfolio uses the IGBT4 – a proven technology that offers high robustness and reliability.

Two versions of the new power modules are also available in the “common emitter” configuration, with which a 3-level topology (NPC2) can be set up. This allows an efficient use in solar and UPS applications where the demand for power is high.

Availability

The new 62 mm power modules are in volume production, they are also available with pre-applied thermal interface material (TIM). Resembling a perfect match for the new 62 mm modules, Infineon also offers new thyristor / diode modules for the input rectifier in 34 mm and 50 mm packages featuring solder bonding technology. More information is available at www.infineon.com/new62mm.
About Infineon

Infineon Technologies AG is a world leader in semiconductor solutions that make life easier, safer and greener. Microelectronics from Infineon is the key to a better future. In the 2016 fiscal year (ending September 30), the company reported sales of about Euro 6.5 billion with more than 36,000 employees worldwide. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY).
Further information is available at

Follow us: twitter.com/Infineonfacebook.com/Infineonplus.google.com/+Infineon
 
 
 
» Infineon Technologies
» Press Releases
» Press Release
Date: 10.03.2017 14:00
Number: INFIPC201703-038e
» Press Photos

 Download der hochauflösenden Version...
The 62 mm package corresponds to the industrial standard and can therefore easily be integrated into existing designs. When applied for drives, it delivers 20 percent more output power in the same footprint.
» Contacts
Infineon Technologies AG

Media Relations
Tel: +49 89-234-28480
Fax: +49 89-234-9554521
media.relations@infineon.com

Investor Relations:
Tel: +49 89 234-26655
Fax: +49 89 234-9552987
investor.relations@infineon.com
» More Press Releases
19.04.2024 10:15
New MOTIX™ motor gate driver IC: enabling easy migration from 12 V to 48 V systems and full support of functional safety requirements

17.04.2024 10:15
Infineon provides FOXESS with power semiconductors to improve efficiency and power density of energy storage applications

15.04.2024 09:00
Infineon receives “GaN Strategic Partner of the Year” award from Chicony Power Technology

12.04.2024 10:15
Vector enables the power of Infineon’s AURIX™ TC4x cyber security features

10.04.2024 11:00
AURIX™ TC4x microcontrollers for embedded AI application development receive safety assessment from Fraunhofer IKS