No more workarounds: The new TO-220 FullPAK Wide Creepage Package
Munich, Germany – April 26, 2016 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced the TO-220 FullPAK Wide Creepage package. The new package is offered for the 600 V CoolMOS™ CE, targeting a broad range of low power consumer applications. This package features an improved creepage and has been developed to meet the demanding requirements of open frame power supplies where pollution might lead to arcing failures of applications.

The TO-220 FullPAK Wide Creepage replaces frequently used workarounds to increase creepage distance such as silicon potting, the usage of sleeves, pre-bending of leads or others. Offering a better alternative to workarounds, customers profit from reduced system costs when implementing the new package.

Wide spread pins prevent failures

The TO-220 FullPAK Wide Creepage package targets open frame power supplies such as TV adapters where dust can enter the case through air vents. These dust particles can reduce the effective creepage between pins over time which may lead to high voltage arcing. The new TO-220 FullPAK Wide Creepage package comes with a pin distance of 4.25 mm instead of the prevailing 2.54 mm found in a standard TO-220 FullPAK package.

The other outer dimensions of the new package are almost identical to the TO-220 FullPAK. Additionally, the new Wide Creepage package shows all the well-known benefits of a standard FullPAK, predominantly its excellent isolation behavior as well as the assembly automation ability.

Availability

The TO-220 FullPAK Wide Creepage package is available now. For further information: www.infineon.com/TO220-FP-widecreepage.
About Infineon

Infineon Technologies AG is a world leader in semiconductor solutions that make life easier, safer and greener. Microelectronics from Infineon is the key to a better future. In the 2015 fiscal year (ending September 30), the company reported sales of about Euro 5.8 billion with some 35,400 employees worldwide. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY).

Further information is available at www.infineon.com
This press release is available online at www.infineon.com/press

Follow us:
twitter.com/Infineonfacebook.com/Infineonplus.google.com/+Infineon
 
 
 
» Infineon Technologies
» Press Releases
» Press Release
Date: 26.04.2016 17:25
Number: INFPMM201604-049
» Press Photos

 Download der hochauflösenden Version...
No need for workarounds such as silicon potting, the usage of sleeves, pre-bending of leads or others: Infineon’s news TO-220 FullPAK Wide Creepage package helps in reducing overall system costs.
» Contacts
Infineon Technologies AG

Media Relations
Tel: +49 89-234-28480
Fax: +49 89-234-9554521
media.relations@infineon.com

Investor Relations:
Tel: +49 89 234-26655
Fax: +49 89 234-9552987
investor.relations@infineon.com
» More Press Releases
28.03.2024 07:00
Infineon and HD Korea Shipbuilding & Offshore Engineering jointly develop ship electrification technology

27.03.2024 14:15
Infineon introduces 80 V MOSFET OptiMOS™ 7 with lowest on-resistance in the industry for automotive applications

26.03.2024 10:15
New SSO10T TSC top-side cooling package for power MOSFETs enables highest efficiency for modern automotive applications

25.03.2024 14:15
Infineon presents innovative semiconductor and microcontroller solutions for a greener future at embedded world 2024

21.03.2024 14:15
Infineon extends its XDP™ digital power protection controller family with the XDP700-002, the industry's first wide input voltage hot-swap controller for telecom infrastructure